Electronics Forum: having (Page 2401 of 3489)

Re: SMD Inspection and Touch-up

Electronics Forum | Mon Jul 26 10:44:08 EDT 1999 | Boca

| There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing

Re: Optimizing PCB for SMT

Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson

| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec

Re: ESD Floor Tile

Electronics Forum | Mon Jul 12 10:29:22 EDT 1999 | Earl Moon

| | | I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me | | | | | | MD Cox | | | | | | Try a search in the archives. A while back someone asked for similar in

Re: Straddle mount connector

Electronics Forum | Thu Jul 08 13:21:18 EDT 1999 | Bob Barr

Ron, We use 100 pin straddle mount connectors on some of our 1.6mm boards (up to eight per board.) They come to us from the vendor with a bead of solder on the somewhat 'J' shaped leads. Our process is as follows: Mount connector to board with hard

Re: Through holes in SMT pads

Electronics Forum | Tue Jul 06 18:16:14 EDT 1999 | Boca

| | Is anyone aware of some guidelines regarding through-hole in SMT pads? One of our designers wants to add through-hole leads in some SMT pads for an inductor. The size of the hole is 0.032 inches and takes-up approximately 25% of the pad area.

Re: VOC free flux wave solder fixtures

Electronics Forum | Tue Jul 06 14:23:27 EDT 1999 | Earl Moon

| | | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so,

Re: No clean solder paste

Electronics Forum | Tue Jul 06 10:12:44 EDT 1999 | John Thorup

| | Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | | | John, | | No clean is as good as your process, and the paste you are using. Everything I do is no cle

Re: product changeovers

Electronics Forum | Fri Jul 02 16:16:53 EDT 1999 | Scotty

| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 13:12:15 EDT 1999 | MD Cox

| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin


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