Electronics Forum | Sat Jul 21 08:45:10 EDT 2001 | davef
In the past, we have spoken [typed?] about controlling the temperature and humidity of our plants. And it's probably good to do that from solder process control, ESD danger reduction, and human factors stand-points. We are looking to lower our ener
Electronics Forum | Wed Jul 25 13:43:53 EDT 2001 | loriannplummer
I have been re-evaluating the way we do our visual inspection processes due to its apparent ineffectiveness. We recently tested this theory by introducing 6 obvious defects on one assembly and gave it to one of our "experienced" visual inspection ope
Electronics Forum | Thu Jul 26 02:20:37 EDT 2001 | mugen
Hey, hey, hey !!!! why do we always think of the BIG names, eh? give the underdog a chance, manz! We evaluated the METCAL bga rework station, (they only have one model going, no worry, its loaded with smart innovations) we gave it thumbs up, 2 thu
Electronics Forum | Sun Jul 29 21:23:27 EDT 2001 | nifhail
When carry out the contamination test,do we measure for Chlorides on water soluble and No-clean fluxes? 1) What is the equivalent factor for machines developed to test the board cleanliness, Omega-meter vs Ionograph vs Zero-ion. 2) What values do we
Electronics Forum | Mon Jul 30 18:07:22 EDT 2001 | mparker
Kenny- there are a few standards by IPC and EIA that address the strength of solder. A pull test (which is a destructive test) will average 1500 PSI per joint. My concern is that you are wanting to increase solder volume for an 0805 component by inc
Electronics Forum | Mon Jul 30 21:31:19 EDT 2001 | kennyhktan
Kenny- there are a few standards by IPC and EIA > that address the strength of solder. A pull test > (which is a destructive test) will average 1500 > PSI per joint. > > My concern is that you are > wanting to increase solder volume for an 0805
Electronics Forum | Fri Aug 03 15:58:07 EDT 2001 | arsmoriendi
Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after i
Electronics Forum | Thu Jan 27 17:54:37 EST 2000 | Steve Harshbarger
Casimir, I have seen exactly what you are experiencing with the Kester 958 on other wave lines. No clean fluxes vary in how much flux residue is visually left behind. These no clean residues are typically not harmful to the PCB, but they are often
Electronics Forum | Wed Jan 26 02:18:18 EST 2000 | k.s park
Hi. man what's your opinion about buying the inspection machine. we have a lot of models but a few of b'ds to produce. the outputs of screen printer was good when i checked with centry 2000 lent. it was almost 6 sigma with the range of LSL &USL i ma
Electronics Forum | Mon Jan 24 16:37:26 EST 2000 | Kris W
To all, This may appear to be laziness on my part, but I need to ask for some advice. We are in the process of qualifying no-clean solder paste to replace or current RMA paste. I have performed qualification runs and extensive reliability testing
