Electronics Forum | Mon Jun 13 09:43:11 EDT 2011 | mosborne1
Delamination almost always is caused by moisture in the PCB. You can try to keep some of the PCBs in a dry box after recieving them. You can also slowly heat them up to bake out moisture. If you are purchasing boards form overseas form a board house
Electronics Forum | Fri Aug 19 02:05:32 EDT 2011 | ppcbs
We have been developing profiles for BGA process going on 14 years now. We have never had to drill holes or resort to any type of destructive methods for BGA assembly, rework or defect analysis. Depending on requirements, i.e BGA rework or BGA assem
Electronics Forum | Thu Aug 25 12:34:48 EDT 2011 | rnkamal
Ryan, Another option to look at would be ultrasonic cleaning if your boards/process would allow it. Automated multi-tank models with wash, rinse and dry capability are available for larger throughput. Typically both wash and rinse tanks have ultra
Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark
Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to
Electronics Forum | Wed Sep 19 12:27:56 EDT 2012 | proceng1
Are you sure that you are getting adequate nitrogen flow up through the cap? If your pump isn't seated properly, you may have nitrogen escaping. Also, I have two different height nitrogen bases. The shorter one does not allow as much gas to escape
Electronics Forum | Fri Nov 04 13:35:17 EDT 2011 | travishemen
Nordson has a viscosity control system and a laser fan width control option. We use the viscosity control system on our machine. Basically it heats the material to a set temp. The laser fan width measures the spray pattern width with a laser and a
Electronics Forum | Tue Nov 15 22:32:07 EST 2011 | doncattoni
Hello Austin, Have you tried to preheat the board or the contact area? Many times with the heat cured materials it will start the cure process and slow the flow of the material. Our Protect-R-Shield silicone product was formulated to be a much thi
Electronics Forum | Thu Jan 12 17:42:55 EST 2012 | warwolf
yeah we are getting quotes on a new solder pot, we have used that paint we tested a small sample of it with solder and it seems to be ok, we are doing a full solder alloy change in about two months so we will have a chance to inspect the solder pot a
Electronics Forum | Thu May 10 22:16:51 EDT 2012 | davef
It's bad practice to remix used solder paste with new solder paste in the jar. Further, some would argue that it's bad practice to reuse solder paste period. If economics force you to reuse solder paste, store it for reuse in an empty jar. When rea
Electronics Forum | Mon May 21 16:06:29 EDT 2012 | solrac
Question, I'm new to this equipment, and have been asked a Question that has me stumped. When calculating the square area for a CCA to determine the volume. What do you do if it does not cover the CCA? I have read the manual and it state that the vo
