Electronics Forum | Tue Sep 26 20:16:07 EDT 2000 | Dave F
I agree with Wolfgang that a check list, like he proposes, is very useful in evaluating your ability to assemble products. No sense designing a 16 inch board if the throat of your wave is 15 inches. Taking a different tact � what if you define your
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G
We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr
Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber
120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr
Electronics Forum | Mon Feb 26 06:23:38 EST 2001 | johnwatt
Folk's, I've been running with the datapaq system for about 5 years now. I have been using it on both reflow and on wave, the only issue I've ever found is that you cannot predict settings for wave, but then you can't do that on Kic and I don't thin
Electronics Forum | Tue Apr 17 21:05:06 EDT 2001 | davef
So, we�re talkin� �bout the smaller end of a "large" paper clip after it�s unfolded once, eh? In keeping with your "nothin� up the sleeves" full disclosure, I�ll bet you�re feelin� a little sheepish about not tellin� us about: * Antenna pad dimen
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Tue Dec 28 15:12:03 EST 1999 | Bill Schreiber
Rick, Ultrasonics is a mechanical scrubbing action (cavitation) similar to any other scrubbing action, if you scrub long enough, you stand the chance of wearing away some of the surface material (shiny coating of a solder joint). The shiny coat on a
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
