Electronics Forum: heating (Page 146 of 301)

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Sat Sep 12 20:28:29 EDT 1998 | Rick Bell

| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the

Re: 5 micrograms

Electronics Forum | Sat Aug 15 13:26:05 EDT 1998 | Bob Willis

| Electrical Eng. is looking for 5 micrograms per sq centimeter. After the board has been cleaned. Is this possible on a fully assembled bd? The European standard often quoted is 1.5 mg/cm which ia achievable on a board assembly please remember one

Re: Misalignment in TBGA?

Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis

Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If

Re: White tin immersion finish

Electronics Forum | Mon Aug 03 12:18:42 EDT 1998 | John Sikes

We have mixed to negative feelings about Omikron, but I beileve it is due to problems with the board fabricator rather than the process itself. When done properly, our Omikron boards have had very good solderability. However, we have had several ru

Solder paste with BGAs?

Electronics Forum | Wed Jul 22 10:26:46 EDT 1998 | Bob Yost

My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board.

Re: Solder paste with BGAs?

Electronics Forum | Thu Jul 23 07:03:09 EDT 1998 | Wayne

| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board

Re: Curing oven

Electronics Forum | Mon Jun 22 14:33:59 EDT 1998 | Justin Medernach

| hi all. | I am looking for a oven which can cure the conformal coating providing heat and the humid atmosphere. I am looking for a temperature range of 60 deg C to 80 deg C and a humidity range of around 80%. | Can anybody refer to me the right v

Re: Curing oven

Electronics Forum | Mon Jun 22 16:55:28 EDT 1998 | Upinder Singh

| | hi all. | | I am looking for a oven which can cure the conformal coating providing heat and the humid atmosphere. I am looking for a temperature range of 60 deg C to 80 deg C and a humidity range of around 80%. | | Can anybody refer to me the r

Looking for Procedures for SMT repair

Electronics Forum | Thu Jun 18 17:16:49 EDT 1998 | Bill Christian

I am looking for a quickly obtainable procedure on the repair of SMT boards. I am particularly interested in discrete components, such as capacitors and resistors. I need to know the importance of pre-heating the board and components. What is a good

Re: Surface Mount Solder Balling

Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens

Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick


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