Electronics Forum: heller any (Page 11 of 16)

Reflow Oven Capability Study

Electronics Forum | Wed Jul 07 16:56:43 EDT 1999 | John Zizzo

Hi! I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board uniformity h

Re: Placement Equipment for 17 x 23 Backplanes?

Electronics Forum | Thu Nov 18 00:28:02 EST 1999 | Scott McKee

Use Mydata. I've built huge backplane boards, round boards, 1/4" thick boards, 1"X24" boards, 1"X1" boards, L-shapes boards; all without any carriers or tooling. If you buy a MY15 you can increase the board size to 5'X2' (60"X24")... As for ovens,

Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko

I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t

Re: Help with new placement equipment

Electronics Forum | Thu Oct 15 21:29:42 EDT 1998 | Scott McKee

| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,

Re: Forced Air Convection Ovens

Electronics Forum | Thu Jan 08 23:49:26 EST 1998 | Scott McKee

| We are currently in the process of analyzing Forced Air Convection Oven systems. The systems in the running are the Electrovert, Vitronics, Conceptronics, and Seho. Service is a big requirement for us. Our plant locations are in Dublin, Ireland

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny

Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro

Pb free BGA voids

Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd

Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints

Film Chip Capacitor reflow problems

Electronics Forum | Fri Sep 08 09:16:37 EDT 2006 | james

We are incurring problems with Film Chip Capacitors with reflow issues. Some of the parts are misaligning or not soldering on one end (almost tombstoning) . We left the parts in the dry cabinet till they were used. We tried both reflow ovens (hell

BGA soldering

Electronics Forum | Tue Dec 18 09:31:45 EST 2007 | rgduval

Bill, Any reflow oven sales guy would be happy to help you with a snazzy sales pitch. I also had some info from paste manufacturers when I pitched it to my boss. Essentially, I believe, it comes down to control. You may be able to get a 4-zone ho

DIMA smro 0406 is good machine or not for doing lead free reflow

Electronics Forum | Wed Dec 10 16:58:53 EST 2014 | sreejhu

Hello, yes you are absolutely correct. I agree with your point. Last week,I personally checked out my board on Heller 1088 which is a 8 zone reflow oven (4 on top and 4 on bottom) and the soldering came pretty nice. So comparing with that situation


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