Electronics Forum: hello (Page 241 of 325)

Re: Surface mount socket savers

Electronics Forum | Sun Oct 10 00:40:42 EDT 1999 | John

| I'm searching for a source for surface mount socket savers that accept a hand test socket (Yamaichi, Nepenthe etc...). Barring availibity of an SMT socket saver does anyone know a good technique for soldering socket savers into a .250" thick, 20+ l

Re: Cost per placement measure

Electronics Forum | Tue Oct 05 06:28:32 EDT 1999 | Wayne S.

|hello morris type in quoting smt in archives and you will get some good insight. i had the same question at one time. wayne I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where

Re: Reflow parts moving

Electronics Forum | Wed Sep 08 13:36:27 EDT 1999 | Wolfgang Busko

| Hello: | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven. When

Re: Reflow parts moving

Electronics Forum | Wed Sep 08 14:31:48 EDT 1999 | John Thorup

| | Hello: | | We are using a Heller 1500S reflow oven to solder surface mount parts. Just within the last two weeks, the larger I.C.'s are moving while going through the oven. The parts are checked for placement before putting into the oven.

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 04:05:15 EDT 1999 | Scott Davies

| Hello everyone, | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. | | Gyve

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Thu Aug 26 04:22:26 EDT 1999 | JAX

| | | | | | | Hello everyone, | | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Than

Re: BGA device continuity testing of solder connections

Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon

| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce

Re: 20 mil qfp bridging

Electronics Forum | Fri Aug 13 12:52:17 EDT 1999 | Steve Schrader

| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi

Re: 20 mil qfp bridging

Electronics Forum | Tue Aug 17 10:41:13 EDT 1999 | Steve A

Wayne, Sounds like a gasketing problem. When the horizontal apertures are bleeding but not the vertical apertures. Could be poor underside support, HASL miniscus issues, masking or plugging issues, but what many people do not account for is that t

Re: Srceen Printing control parameters

Electronics Forum | Thu Aug 19 19:10:31 EDT 1999 | Brian Wycoff

| | | | Hello, | | | | | | | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | | | | | | | B.Regards, | | | | Felix | | | | | | | I have a proce


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