Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
Electronics Forum | Thu Jul 29 01:01:11 EDT 1999 | DLKearns
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hunter, YES ICT after SMT reflow is expensive, we currently onlt t
Electronics Forum | Tue Jul 20 11:33:55 EDT 1999 | Ted Kress
| | I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many ty
Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Fri Jul 16 06:22:31 EDT 1999 | Wayne Sanita
Mark, I had the same peoblem. For my stencils i use a 15% reduction for the width of fine pitch leads only, as Earl said follow the 1:1.5 standard. We consider pitches of 32mil and under. We also clean the stencil every other board to ensure no caki
Electronics Forum | Fri Jul 16 10:32:52 EDT 1999 | Upinder Singh
| | Hello All, | | I am setting up a line to mount CSP/uBGA devices and now am looking at the X-Ray process. It is my opinion that this should be done offline - can you tell me if Im right or do I need to put one inline? | | Also anyone who is mou
Electronics Forum | Tue Jul 13 10:26:38 EDT 1999 | HST-SE
| | Hi, | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | Secondly, I n
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Mon Jul 12 10:29:22 EDT 1999 | Earl Moon
| | | I am looking for suppliers of ESD floor coverings. I currently have ESD carpet and I would like to replace them with ESD Tile. Help Me | | | | | | MD Cox | | | | | | Try a search in the archives. A while back someone asked for similar in
