Electronics Forum | Sun Jan 11 12:03:51 EST 1998 | Bob Willis
As a basic guide the minimum spec you should look for is 500g you should achieve a force on most chip parts of 800-1000g. Parts are lost on wave soldering due to no material, poor curing, poor surface adhesion and poor handling. Its not the wave sold
Electronics Forum | Sun Jan 11 11:59:13 EST 1998 | Bob Willis
VP does work well for BGA Technology but it is not any great improvement on convection reflow. It has been stated in a coulpe of articles that there is no delta T difference with VP from the surface ofthe board and under the BGA. That is not true jus
Electronics Forum | Sat Sep 29 08:12:06 EDT 2001 | roland
Gregory, Thank you for posting the results of running your boards yesterday (glad to hear everything worked out well). I am sure other SMTneters are glad to see the sharing of their information helped. Perhaps others who have used information pr
Electronics Forum | Fri Aug 10 13:30:46 EDT 2001 | mzaboogie
Good Afternoon. Hope all is well with everyone. > I was wondering, What is the preferred equipment > to use for BGA rework/replacement and xray? I > would like to know what equipment you are using > and your likes/dislikes of the equipment.
Electronics Forum | Thu Aug 09 23:11:23 EDT 2001 | davef
Cheery disposition??? Would a few ;-) ;-) ;-) help? [Oh and look who is talking, the one planning the Mickie D gig after the traces on the this board start vaporizing with the fuseable link schtik.] Are you sure you're getting flux all the way up
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Mon Aug 13 05:17:16 EDT 2001 | nifhail
Normally the specs I monitored in our temperature profiles are Slope 1-2 Deg C/sec, preheat 60 - 120 Sec at 120 Deg C - 150 Deg C, peak 215+/- 10 Deg C, above 183 Deg C is 45 - 75 Sec, total reflow is 3 - 5 minutes. Why is it that we don't monitor
Electronics Forum | Fri Aug 17 09:42:18 EDT 2001 | Hussman
G'Day All, I have a couple of new Panasonic MSR's. Whenever I load a new program into the machine, I have to manually feed the first PCB onto the X/Y table to get it to run. After that, they run just fine. Panasonic is going to be in and they hav
Electronics Forum | Mon Aug 27 12:29:48 EDT 2001 | ChinaMex
We're producing a quite large scale on PCB's in different sizes and desity as well as various component sizes. Time by time and very sudden we have the Tombstone effect. Evaluations by the technic dept. didn't show the sufficient result of where t
Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef
Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A
