Electronics Forum: high temp solder (Page 281 of 323)

Solder Recovery System (SRS)

Electronics Forum | Fri Oct 09 15:06:22 EDT 1998 | Chrys

Dave F asked me for an update on the SRS we evaluated last month... I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration method mu

Re: Solder Recovery System (SRS)

Electronics Forum | Fri Oct 09 16:33:08 EDT 1998 | Dave F

| Dave F asked me for an update on the SRS we evaluated last month... | | I like this machine. Over 80% of your wave dross is actually good solder; you just can't get to it without some type of separating agent. I like the mechanical sepration met

Pasting ahead

Electronics Forum | Mon Nov 06 14:00:45 EST 2006 | nodlac

Checks calendar ...nope not April 1st. -The fresher the paste the better the solder joint. Agreed - My dilema here is upper management wants the two lines to share one stencil printer thus saving the cost of purchasing a second printer. They propos

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 06:18:18 EST 1999 | stefano bolleri

Jeff & Ted, we have used a dispensing system too and yes, I agree, we are not too happy with the results. Not at the point that it doesn't work, though. I think our problem basicly is that we have selected an entry-level dipensing system. We are app

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: Selective Wave Solder Palletizing

Electronics Forum | Mon Feb 08 17:11:04 EST 1999 | chris arnold

| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. Earl, Pallets can be extremely u

CSP/BGA Assembly Solutions

Electronics Forum | Mon Jan 04 23:15:35 EST 1999 | Kris Ewen

Where I worked, we used 0.014" square aperatures (several mfgs. have proven the benefits of square & I've seen a better transfer efficiency myself). Some mfgs use smaller edge lengths & have had success. 0.005" thick stencils give better transfer e

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 03:33:50 EDT 1998 | Thomas Blesinger

| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain

Re: Washing boards with paste...?

Electronics Forum | Mon Sep 14 11:56:38 EDT 1998 | Ben Salisbury

| Our company currently donesn't have any type of sonic wash to wash boards that have been "miss printed" Wanting to know the best way to go about this. So what we are having to do is spray down the boards with alcohol and wipeing the solder paste

Re: Ball Grid Array (BGA)

Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon

| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re


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