Electronics Forum: hips (Page 1 of 3)

HIP defect in BGA

Electronics Forum | Sun Jun 14 13:16:10 EDT 2020 | davef

Where are HIP connections located?

HIP defect in BGA

Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw

I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?

HIP defect in BGA

Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan

Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re

Omniflow reflow blowers going bad ?

Electronics Forum | Wed Sep 12 11:03:35 EDT 2007 | cyber_wolf

Ya I am hip on the caps. These blowers squeel then quit.

HIP defect in BGA

Electronics Forum | Tue Jun 09 12:08:34 EDT 2020 | dontfeedphils

Any reason you're doing a RSS profile rather than a RTS?

HIP defect in BGA

Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan

Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ

HIP defect in BGA

Electronics Forum | Tue Jun 23 13:23:55 EDT 2020 | emeto

If you swear in having consistent print, I bet you it is the part. Some of these BGAs probably have missing or inconsistent balls.

Head in Pillow defects with memory components

Electronics Forum | Wed Dec 21 11:33:22 EST 2022 | SMTA-64304420

Does anyone have experience with HiP defects with DDR memory components that they would be willing to share? I am interested in SMT process corrective actions and repair processes. I can discuss this privately if needed.

Head in Pillow defects with memory components

Electronics Forum | Wed Dec 28 16:49:26 EST 2022 | emeto

HiP most of the time goes back to the component package itself. If they are on the periphery of the part, it is a result excessive of expansion and contraction from the temperature. If it is in the middle, other contributors come in place.

HIP defect in BGA

Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan

Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr

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