Electronics Forum | Wed Apr 29 08:55:49 EDT 2009 | nibirta
was the first thing we did. No improvements. In the meanwhile we have change the lot of the components. and it seems that there is humidity absorbed by the components. we are cooking now the lot and waiting for improvemnets. thk u for the support
Electronics Forum | Sun Nov 22 19:53:10 EST 2009 | prodrivegsr
Hi Ju Yong, The PCB are dry in an airseal cabinet(Staging Chamber) before IR Oven. The bubbles show at around body and solder joint area. You mean the moisture will create bubbles ? Able to advice the humidity and temperature that you are using in
Electronics Forum | Tue May 11 09:44:48 EDT 2010 | dyoungquist
Lower humidity: Pros: Helps with mositure sentative devices. Cons: 1)Paste exposed to the dry air during your porcess will dry out quicker. 2) Drier air promotes more ESD issues, i.e. more electrostatic generation.
Electronics Forum | Fri May 28 09:55:36 EDT 2010 | ccouture
What is the humidity level in your facility? We maintain ~40% year round and never have any issues regarding ESD from cover tape peeling.
Electronics Forum | Fri Dec 03 05:32:03 EST 2010 | libandara
Dear Graham, Thanks for the information. is there any way to control the humidity inside the oven..? At over 100 C. how the evaporated vapour from the component remove out from the oven..?
Electronics Forum | Wed Dec 08 20:58:17 EST 2010 | Jacki
Hi Dave Now, I knew the Humidity for Solder paste. How about for the Epoxy? Very appreciates your soon reply. Thanks
Electronics Forum | Thu Dec 09 02:27:41 EST 2010 | fönsi
Hi Dave! Thank you very much for your effort. So then we will try to increase humidity to about 40 percent rel. I think, we won't increase it to more than 40 percent because of the MSL-3 components. regards
Electronics Forum | Tue Dec 14 02:19:03 EST 2010 | sachu_70
With lower Humidity levels, we expose to greater risk towards ESD related failures seen on components. Pl. ensure to have your entire work area fully guarded against ESD and maintain proper material handling instructions across the entire flowline un
Electronics Forum | Wed Jan 12 10:41:20 EST 2011 | padawanlinuxero
Hello guys ! I have a problem, I am finding some blow holes in the solder join in a resistors pad, can this be because of high humidity in the board? does baking the boards fix the problem? thanks
Electronics Forum | Fri Jan 21 11:00:56 EST 2011 | xps
Hi, in my experience, the humidity is trapped in the solder paste. Otherwise you can also try to : adjust preheat profile, and /or increase paste viscosity, and /or increase paste metal content (they are the most common causes).
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