Electronics Forum | Thu Sep 23 12:30:52 EDT 1999 | Wolfgang Busko
| | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (n
Electronics Forum | Thu Sep 23 12:43:27 EDT 1999 | Earl Moon
| | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations
Electronics Forum | Sat Sep 25 08:00:11 EDT 1999 | Brian
| | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead termination
Electronics Forum | Sat Sep 25 11:05:08 EDT 1999 | Earl Moon
| | | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminati
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Tue Oct 12 05:46:12 EDT 1999 | Brian
| Thank you all for your replies. I guess my age in this industry is showing. This military spec. does not appear to be in existance. So, let me make my request a little more to the point: | | Is anyone aware of a specification specifically refer
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Sat Aug 07 11:47:47 EDT 1999 | JohnW
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Wed Jun 02 23:53:09 EDT 1999 | Dean
| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro
