Electronics Forum | Thu Jun 26 14:03:26 EDT 2003 | cristiano
I am looking for information about SMT machines obsolescence face to new types of components packaging like BGA�s and flip chips 0201 chips and others. I want to begin a study about industry trends that will help us to define what kind of equipment
Electronics Forum | Fri Jun 27 08:39:35 EDT 2003 | davef
It's a excellent idea to monitor the cleanliness of your components and soldering process. Consider running a spare board.
Electronics Forum | Fri Jun 27 10:48:18 EDT 2003 | Steve
We have considered running a spare board with each job as a possible solution, however due to the cost of the assembly, this would not be preferred.
Electronics Forum | Fri Jun 27 08:35:54 EDT 2003 | davef
We run a few standard recipes, because we don't like waiting for and determining if our oven has stabalized after dialing-in a new recipe.
Electronics Forum | Fri Jun 27 08:32:08 EDT 2003 | davef
You should be fine. A fifteen percent reduction of these pads will probably improve reliability, depending on spacing of course.
Electronics Forum | Fri Jun 27 10:04:55 EDT 2003 | Charlie Finke
Does anyone know of a good web site that lists general package dimensions for various SMT device sizes, like 1206, etc.?
Electronics Forum | Tue Jul 01 07:12:12 EDT 2003 | iman
actually, component sellers will have their own respective catalogue with all the available sizes used in their industrial business. Try your local "Rohm/Murata" sales-rep. for starters in the realm of chip components.
Electronics Forum | Wed Jul 02 06:56:34 EDT 2003 | davef
There's nothing wrong doing about adding a dessicant. You'll need to: * Seal the bag. [you may end-up needing a moisture barrier bag] * Select a dessicant packaging that is ESD dissipative.
Electronics Forum | Mon Jun 30 08:55:45 EDT 2003 | Steve Gregory
Has anybody ever done a double-sided reflow with a Altera 240-pin RQFP on the bottom? The part has a heatsink in the top and weighs just over a half-ounce... Thanks in advance! -Steve Gregory-
Electronics Forum | Tue Jul 01 01:37:00 EDT 2003 | bkyip
Can anyone advise whether it is fine to use "stretch film" to shrink wrap ESD-safe box that contains work-in-progress PCB? If no, what is the consequences? Please advise.