Electronics Forum | Tue Mar 15 10:18:15 EDT 2011 | grahamcooper22
Hi, Does anyone have any experience of cleaning lead free solder paste residues off pcbs in a vapour degreasing process using Ensolv Ionic ? Any guide as to the best cleaning cycle would be appreciated. thanks
Electronics Forum | Thu Mar 17 15:34:35 EDT 2011 | grahamcooper22
Dear Rick , thanks for your reply. It is very helpful. I'll get chance to try the Ensolv in a lab next week to see if we can remove the paste residues. Thanks again
Electronics Forum | Thu Mar 17 09:36:42 EDT 2011 | swag
We inspect incoming stencils to see if they are labelled properly and sometimes check the width of special apertures and that's about it. We want to kick it up a notch. What are others out there doing to inpect incoming stencils? Is there criteria
Electronics Forum | Wed Apr 06 10:18:02 EDT 2011 | PB
I have done the same thing. We are changing over to the Indium 8.9E solder paste. It prints great and the joints look great. Does not look like a lead free alloy. We have turned off the nitrogen.
Electronics Forum | Fri Mar 18 15:39:18 EDT 2011 | bk
Tyco had a good read on the shelf life of tin plating and the different variables involved in determining it's shelf life. http://www.tycoelectronics.com/documentation/whitepapers/pdf/Keeping_Tin_Solderable.pdf
Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Electronics Forum | Mon Mar 21 12:36:22 EDT 2011 | scottp
I would run the passive side first just because the BGA is probably moisture sensitive and I wouldn't want to have to keep track of the time between first and second reflow.
Electronics Forum | Mon Mar 21 12:43:20 EDT 2011 | hegemon
Passives first reflow, and BGAs second side reflow. Uses only one heating cycle for your BGAs, and the passives will stay in place just fine given correct profile parameters. There are a few exceptions, but this is generally how it is done. My $.02
Electronics Forum | Fri Mar 25 04:28:54 EDT 2011 | grahamcooper22
Are the solder balls what we would call ' mid chip ' solder balls where a single or sometimes a few larger solder balls are positioned somewhere along the side of the chip or are they the solder paste powder particles spread around the pads ?
Electronics Forum | Fri Mar 25 08:54:59 EDT 2011 | mosborne1
Have you checked your reflow profile? You need top make sure that you are with the specification of the solder paste. We currntly use the Kic thermal profiling device.
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