Electronics Forum: index (Page 3765 of 7897)

Re: Solder Paste Height

Electronics Forum | Sat Jan 06 11:39:56 EST 2001 | Steve Thomas

On a related note, I'm wondering if any of the newer devices have any way to factor in paste not releasing from the corners, or for that matter, radiused, oval, or round apertures. We have an LSMII, and all it does it let you draw a rectangle around

ESD floor paint/coating

Electronics Forum | Fri Jan 05 11:42:15 EST 2001 | John

We are planning out an expansion project. Currently we have vinyl esd tile in our production area. We've found this to be expensive, easy to damage, and a pain to repair. Has anyone had any experience with ESD floor coatings/paints??? Any advice

Re: ESD floor paint/coating

Electronics Forum | Fri Jan 05 13:56:41 EST 2001 | csullivan

We currently use a "wax" ESD coating on our floor. It is cheap and easy to repair. However, the maintenace on it is extensive. It also needs to be re-"waxed" quite often. There are permant coatings out there. I have started to look into these pro

ECD Fluxometer

Electronics Forum | Thu Jan 04 03:01:34 EST 2001 | Sal

Guys Has anybody out there purchased or had any experience with the ECD Fluxometer. I've been shown a very quick demonsration but I'm still not 100% confident. For instance the mesh thickness is 0.006 mil and the yet the thickness of our boards are

Consumables

Electronics Forum | Wed Jan 03 08:22:08 EST 2001 | G. English

Hi, all the best to you smt' netters for the forthcoming year. I am looking for a one stop shop for surface mount consumables, in particular, stencil IPA wipes, printer under screen cleaning rolls, gloves, dry wipes, squeegee blade replacements etc

Re: multicore?

Electronics Forum | Wed Jan 03 21:14:04 EST 2001 | Greenman

This is news to me that I seriously doubt. Couldn't be someone from the competition that told you this, could it? Tim Skidmore just got made Chair of the IPC Solder Paste Task Group, so if they're pulling out of solder altogether (to do what instead

BGA coplanarity

Electronics Forum | Wed Dec 27 17:13:28 EST 2000 | John K.

As part of an Intel erratum, they changed their BGA coplanarity spec from .006" to .008". The package is 23 X 23 partial array, .050"(1.27) pitch, 1.220"(31) square. We apply paste onto BGA pads with a 6-mil stencil. From a process perspective, sh

Re: Dimensions of waffel trays

Electronics Forum | Wed Dec 27 21:16:51 EST 2000 | Dave F

Expanding on Dason's suggestion ... 4 Waffle Tray Size 4a www.jedec.org/download/default.htm search for "registered microelectronic carrier". 4b JEDEC Publication 95, under the CO- and CS- standards. 4c Tray manufacturers [ie, Peak, Summit, Nepenthe

Re: Double sided assembly

Electronics Forum | Fri Dec 22 17:25:00 EST 2000 | Dave F

I'd bet money our operators could use the wrong paste at the wrong time with out the slightest hesitance. This seems to be a fairly novel approach to making things complicated. I will admit I've heard of people talking about doing this, but I must

Tombstoning 0402

Electronics Forum | Thu Dec 21 19:24:25 EST 2000 | Alejandro Rodriguez Gallegos

Hi Sorry my poor english We have some problems with some componentes 0402 we recived by the manucterer oxide in the tape reells exactly in the bottom side to the reel I think the root cause is the oxide in the tapes rells What do you think? And ot


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