Electronics Forum: index (Page 5176 of 7929)

Re: Cost per placement measure

Electronics Forum | Tue Oct 05 01:22:46 EDT 1999 | Karlin

| I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where I might find a published industry average that we may compare to? | | I�ve heard it stated that an industry average is less t

Program Optimization of Sanyo V820 series (V822,821)

Electronics Forum | Fri Sep 24 20:40:18 EDT 2004 | dennispoquiz

Date: September 07, 2004 09:23 AM Author: V.Hazzlewood Subject: Program Optimization of Sanyo V820 series (V822,821) I use a V820 machine. There is no command. I have also got a manual for a V821 machine and they have included a command. In the

Need help on selecting the SMT equipment for small volume

Electronics Forum | Wed Jul 20 12:48:50 EDT 2005 | danhui888

Dear All, I'm looking for the complete SMT > equiment line (solder printer, P&P, Reflow) uses > for the small volume production line. I happen to > know that Manncorp and APSGold can provide the > complete ST line, but I haven't hear and use > t

Re: BGA and PCB finishing

Electronics Forum | Tue Mar 14 07:59:41 EST 2000 | JAX

Emmanuel, The discussion on what finish to use whether it be HASL, Immersion gold over nickel, Organic Solderability Preservatives, ect...... is still ongoing. This is not the only decision you need to make. Do you plan on Soldermask Defined Pads? Wh

Re: Min Hole/Pad distance to edge of PCB

Electronics Forum | Tue Mar 14 21:22:41 EST 2000 | Dave F

Bingo!!! By panelizing and adding breakaway rails (as Nancy says), Stuart can pour copper up to his board fab's tolerance from the board edge. Traditionally, he just wants to make sure no copper shows on the edge of the board. Then again, it's his

Re: HAL vs. Silver Coated

Electronics Forum | Fri Mar 10 09:01:44 EST 2000 | Wolfgang Busko

Hi John, we had one shot with silver coated PCBs. With "no clean" and no changes in process parameters ( we had no input on necessary changes from the boardhouse ) we encountered wetting problems in the first reflow soldering process. Later it was s

Re: BGA design Guidelines

Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko

Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse

Re: RE: Failure of Moisture Barrier Bags Shipped by Air

Electronics Forum | Thu Mar 09 22:03:04 EST 2000 | Charles Leech

DaveF: Since these SMT "spounges" get wet in Singapore and they got to get dry in Singapore, the airfreight idea won't work. I don't think the airlines would be too thrilled with a teathered ballon floating 10,000 feet in the air over the city. STAT

Re: Hot Air Knife

Electronics Forum | Thu Mar 09 04:02:12 EST 2000 | Wolfgang Busko

We used an air knife using foam fluxer and no clean flux to remove excessive flux from the boards for a better look afterwards. A secondary effect might be that the flux is forced into the vias giving you better results on the top. If you feel a need

Pallet For PCB

Electronics Forum | Tue Mar 07 12:54:27 EST 2000 | Mark D.

Does anyone know of a vendor who manufactures pallets for PCB's. I have a couple of boards where the parts are too close to the edge to allow them to be placed in my Pick & Place equipment (nozzle will hit conveyor rail). I know that pallets are made


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