Electronics Forum: index (Page 5371 of 7929)

Re: Conductive Adhesives and Underfill used on flex ckt

Electronics Forum | Tue Jan 12 15:04:40 EST 1999 | Earl Moon

| I have used conductive adhesives for some time now on thickfilm. Does anyone know of a really good conductive adhesive to attach flip chips to flex circuits? I would like to stencil print the adhesive to the substrate and then place the flips chi

Re: 2%Ag?

Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean

| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be

Re: 2%Ag?

Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F

| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used

Re: Lead Free Solder used in BGA

Electronics Forum | Tue Jan 12 19:57:37 EST 1999 | Ross Berntson

| Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | Kelvin

Re: Desoldering of TSOP and TSOJ

Electronics Forum | Fri Jan 08 15:02:38 EST 1999 | Dave F

| HI! I am a package engineer in Korea. I have some reasons | to desolder excessive solder at the lead of TSOP and TSOJ | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | Does anyone

Re: SMT Process Control

Electronics Forum | Thu Jan 07 10:41:04 EST 1999 | Dave F

| We are struggling with an effective way to control our SMT processes. I'm curious as to what parameters other companies monitor in their processes and how to control the quality coming off the end of the SMT line. We are currently restricted to a

Re: stencil condition

Electronics Forum | Thu Jan 07 16:40:26 EST 1999 | MMurphy

| | What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | | | Ken Mok, based in Shenzhen, China. | | | | | |

Re: stencil condition

Electronics Forum | Sat Jan 09 16:01:18 EST 1999 | Jason Hall

| What kind of equipment are you using to gauge the thickness of your stencil after it's used for some months? How to determin the condition of the stencil? Your input is much appreciated. | | Ken Mok, based in Shenzhen, China. | | Ken, I have neve

here's one for you board stuffers!!!

Electronics Forum | Wed Jan 06 22:59:22 EST 1999 | Tim

Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you expect

Re: PCB Repair Training

Electronics Forum | Tue Jan 05 22:18:50 EST 1999 | Cunli Jia @ SMTnet

Tony, Please check out PRECISION PCB SERVICES, INC. in Santa Clara, CA. They specialize in PCB repair including training. Call (408) 654-0773 and ask for Dennis, or e-mail him at ppcbs@aol.com. Their web site is listed below too. Good luck. Cunl


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