Electronics Forum | Tue Apr 12 11:55:06 EDT 2022 | ilavu
We have one JOT magazine loader and PLC died on it. I contacted JOT multiple time to get replacement PLC or backup of PLC and no answer from their support. I have same model of PLC but I dont have PLC program backup. Can anyone here help me who have
Electronics Forum | Wed Apr 13 12:39:20 EDT 2022 | SMTA-64386699
We produce some heavy copper multi-layer boards. 4-6 layer typ with 3oz throughout. WE currently are using a Heller 1912EXL with belt speed around 32-36 in/min. I am looking to replace this oven with a more efficient unit. To the best of my knowledg
Electronics Forum | Wed Apr 13 21:17:18 EDT 2022 | stephendo
If it was ROHS, I would say that the pads are definitely dissolved away. And it sounds like that is the case here. Your best bet is if it is class 2 and the barrels are at least 50% then push for them to be accepted. If you are trying for more barr
Electronics Forum | Thu Apr 14 14:00:44 EDT 2022 | winston_one
Also at few boards we see excessive voiding, extremily excessive. During solderind some bubbling can be observed near the soldering point. Boards was dried before assembly. May be we have a problem with too thin metallisation - that's why poor adhesi
Electronics Forum | Thu Apr 14 14:16:51 EDT 2022 | dsmith
Hello and good morning. I've recently encountered an issue with a DEK tool and no one is able to remedy it. During the initializing phase, the table begins "bouncing" up and down and never stops, halting the process. There's a pass through proximit
Electronics Forum | Thu Apr 14 15:33:41 EDT 2022 | ppcbs
I've never lost memory in a BGA from heat removal. However we can create a profile on our BGA rework stations to remove using bottom heat only. This exposes the BGA body to temperatures of around 190 to 200C. I have a colleague that has a machine
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Fri Apr 15 09:56:17 EDT 2022 | winston_one
Thank's Dennis. I'm also now think in this direction. Process was adjusted and soldering are good. But one from five boards can have this effect with bubbles and strange uneven distribution of solder inside the barrel. Probably copper is too thin and
Electronics Forum | Sun Apr 17 00:04:03 EDT 2022 | klauss
I am mounting 3535 Cree High-power leds with p&p machine. First nozzle picks up the led normally and then it's placed good but after 4-5 times nozzle picks up the led like at an angle. looks like it holds the led from the side edge of the dome.
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
