Electronics Forum | Thu Jun 28 12:44:11 EDT 2018 | dleeper
A few questions: How did you put the wrong part on for so many years and not catch it? Was this due to an error in the customer supplied data like an incorrect BoM or an internal error such as a P&P machine programming error? How wrong was the wron
Electronics Forum | Tue Aug 14 16:18:48 EDT 2018 | dontfeedphils
A couple of things to try as I just went through this myself. Checkout this link for pointers on plasma cleaning... http://www.nordson.com/~/media/Files/Nordson/march/Papers/The-Effects-of-Plasma-Treatment-Prior-to-Conformal-Coating-NordsonMARCH.p
Electronics Forum | Tue Jul 03 10:20:15 EDT 2018 | yannis
Our firm is SMT factory exclude design, components are selected by customers. We are going on a project by studying the solderability life of warranty at least 3 year for customers requirement. The theory is if the workmanship is good enough, then th
Electronics Forum | Wed Jul 11 06:14:21 EDT 2018 | uzbek
Hello, we are currently designing one device that needs shielding. Under the shield, there is one BGA chip and 0402 components. Now we have a dilemma whether we should go for a one-part shield or two-part shield. We talked with several EMS companie
Electronics Forum | Wed Aug 01 18:36:15 EDT 2018 | totalmedtech
Open->Job, you can select either 'Gerber' or 'Gerber274x' If you create the layer yourself you just need to press 'Add' in the bottom right of the screen and give it a name that means something to you, and the correct extension (I assume you know thi
Electronics Forum | Fri Jul 20 13:50:22 EDT 2018 | vchauhan
This question is regarding stencil design: I am having voids under QFN TI P/N LMZ20502SILT. I have attached component pic. Signal pin is 18X16 mils. Center pads are 31 mil sq. Initially I had stencil done with one mil per side reduction on signal pad
Electronics Forum | Fri Jul 27 09:47:20 EDT 2018 | davef
Adding to Rob's suggestions ... One of the theories about voiding in thermal / ground pads of BTC is: Solder starts melting at the edge of the pad and moves inward towards the center of the solder mass. This traps flux volatilizes. So, there needs t
Electronics Forum | Tue Aug 14 08:19:45 EDT 2018 | buckcho
Hello, other colleagues gave you valid ideas. I found it helpful if i reduce the size of the cooling openings. I would suggest making the four big square into very small many diamonds. This would maybe decrease your voiding with 2-4 percent. Btw how
Electronics Forum | Tue Jul 24 09:20:44 EDT 2018 | fugtussey
Note that the TF2800 features a large 7 panel preheater with an adjustable height component that allows you to adjust the height of the IR preheater to get much closer to the board. This feature multiples the power of the preheater exponentially, so
Electronics Forum | Wed Jul 25 02:40:24 EDT 2018 | cannizzaro
I have a question about the Gerber file format for PCB prototype. The CAD program I am using is a DOS version and generates Gerber files in the RS-274-D format. However, ALLPCB require the Gerber files in the RS-274-X format. I have to approach other
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