Electronics Forum: index (Page 7281 of 7929)

Re: Solder Balling Beading Effect

Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron

Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Poor solder joints on QFP 100's

Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.

Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to

Re: Poor solder joints on QFP 100's

Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra

Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t

Re: Soldering long lead thru hole parts

Electronics Forum | Thu Dec 09 23:57:41 EST 1999 | Jeff Sanchez

Mike, A drag solder system is not so bad. If it's not discoloring the silk screen , damaging your parts or blistering your boards than it looks like a safe bet. I am not sure what other components you have on the boards besides the LED's? But the

un-tested assembled circuit reject rates

Electronics Forum | Tue Dec 07 13:40:25 EST 1999 | Tim

The company I represent provides electronic manufacturing services. Some of my customers ask that we ship their boards "un-tested". By un-tested I mean we build them, visually inspect them and out they go. I find that on un-tested boards, it's not

Re: un-tested assembled circuit reject rates

Electronics Forum | Wed Dec 08 02:07:25 EST 1999 | Scott Cook

Tim, What Brian writes is all true. However, let em put it into a sales / marketing perspective..... The REAL issue in your situation is: Who is responsible for the failures which WILL result in shipping untested product? Typically, your customer

Re: Parts Wastage Allowance

Electronics Forum | Mon Dec 06 04:48:53 EST 1999 | Charles Stringer

Greg This is one of the eternal questions. I have racked my brains over this one in many organisations. If you are a low volume user (as your run size of 100 to 1000 would indicate) then you are likely to loose more taped components from loading and

Re: White Residue

Electronics Forum | Fri Dec 10 08:44:52 EST 1999 | Dave F

Vinesh: You�ll find no papers that "clearly describes the harmful effects" of your style "of white residues," because no one is crazy enough to brag that they are doing what your customer wants you to do. The residue of no-clean fluxes are designe

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May

Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa


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