Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
Electronics Forum | Tue Dec 21 13:27:47 EST 1999 | Vince Whipple
Charlie: As far as setting up a spray fluxer.. Are you spraying no-clean, voc free, water soluble? What you would want to do is to run a blank pcb through the fluxer and pop it out before the preheaters. Visually inspect for variations in uniformit
Electronics Forum | Tue Dec 14 10:36:42 EST 1999 | Paul Peterson
I recently encountered reflow soldering defects on a pair diode package, the smd pad had a green contamination, I'm convinced that this is not oxidation. The no-solder condition appears to be caused by a sloppy soldermask process, although over the y
Electronics Forum | Tue Dec 14 11:08:19 EST 1999 | John Thorup
I think you're on the right track Paul. You didn't mention what type of solder mask was used but I'll presume that it was LPI (liquid photo imagable). If development of the image is incomplete some mask can remain where it is unwanted. Sometimes im
Electronics Forum | Thu Oct 28 12:02:13 EDT 1999 | John Thorup
Automation and low cost is an oxymoron sort of like jumbo shrimp. Automation will set you back $20,000-100,000. Optical comparitors aren't cheap either. Low cost means good eyeballs, a "golden" sample board and up-to-date documentation. Also low c
Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F
Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo
Electronics Forum | Fri Oct 22 09:44:42 EDT 1999 | John Bashe
The CCGA package is difficult to handle and automate in the assembly process. The leads can be fragile, and vision recognition of the package and leads is difficult. Special lighting and/or a special vision algorithm will probably be needed if you wa
Electronics Forum | Tue Oct 12 10:24:50 EDT 1999 | Jose RG
Hi, We are in the way to evaluate different solder pastes, improve our solder paste incoming inspection steps, re-define our stencil requirements and the following questions are open. Two questions, 1- Is anybody using/requiring 1000 Kcps or more
Electronics Forum | Tue Oct 12 16:55:42 EDT 1999 | Mike Demos
Thanks for all of your replys. I will include these in our design review meeting tomorrow! | In a cost-reduction effort, our Design group is attempting to eliminate silk-screen (legend ink) on some new products. By the elimination of this process,
Electronics Forum | Tue Oct 05 16:42:57 EDT 1999 | Dave Pearcy
I would like comments on how the industry handles 0402 parts, regarding identification. Since the parts are too small to be labeled, how can we accurately identify the parts and or values, either before or after assembly? When the boards go to test,
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