Electronics Forum | Thu Mar 04 16:40:06 EST 1999 | Dave F
| Hi, | | For hand placement you should see about 150-200 ppm of errors (solder, placement, values etc) on a board populated of types such as 1206, 0805, SOT, Tantalum etc. . As for solely wrong components (component at wrong location) you can usual
Electronics Forum | Fri Feb 19 02:11:11 EST 1999 | Pete Sorenson
| During inspection and test we find leads which do not get soldered. Some are because of insufficient paste, but with others everything looks right. This will only happen on 1 to 2 pins, and it is not isolated to a specific type of ic or location o
Electronics Forum | Tue Jan 12 17:56:18 EST 1999 | Jason Hall
| For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | It appears to me that there are two options: | A: to have a pn chart based upon
Electronics Forum | Tue Oct 27 09:57:37 EST 1998 | Dave
I completely agree with what Dave said previously about the trimming process. I spent the first 6 months at my current job removing this process from our assembly floor. We had several problems with the process including: 1) "flags" from the leads
Electronics Forum | Mon Oct 19 15:37:12 EDT 1998 | Manish
Hello everybody This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. I need information about the following: 1
Electronics Forum | Fri Sep 25 06:39:15 EDT 1998 | Wayne Bracy
| Does anyone know where I can get conductive benchtops? NOTE: I don't want a mat and I'm already using (and unhappy with) a laminate surface glued to a wooden table. Any and all info would be very much appreciated. | BTW: I'm also looking for conduc
Electronics Forum | Wed Sep 16 10:35:45 EDT 1998 | John McMasters
| | Has anyone used Fuji's rubber tip nozzles for the IP3? Are they O-ring type or suction cup? I'm having trouble picking up Ompacs due to the top of the part not consistently being flat. Any actual experience with these $1100 nozzles would be app
Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris
| Hi, | We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.
Electronics Forum | Thu Aug 27 20:06:25 EDT 1998 | Kallol Chakraborty
Hi folks, Lately I am also having problem with BGA ball problem. We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could rework on CCGA but there is no certified process in industry as we speak
Electronics Forum | Sat Aug 29 09:12:39 EDT 1998 | Dave F
| Hi folks, | Lately I am also having problem with BGA ball problem. | We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could | rework on CCGA but there is no certified process in industry as w
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