Electronics Forum: inspection devices (Page 1 of 21)

Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 07:15:49 EDT 1999 | SC

I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capabl

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Thu Jun 03 15:15:09 EDT 1999 | J.S.

| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien

| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca

CGA devices - placement and vision

Electronics Forum | Mon Feb 26 16:26:00 EST 2001 | jax

I have not placed these parts in a while but when I did Universal was the machine that did it. We were able to place these parts using a 1mil flat( upward looking camera) inspecting all columns. The problem is a 100% column recognition is not possibl

CGA devices - placement and vision

Electronics Forum | Mon Feb 26 14:06:09 EST 2001 | marting

We have just started to be involved with collumn grid array devices and are currently placing them by Universal GSM machinery. We have been advised by Universal that they supply "On Axis" cameras designed for visioning CGA devices, however the cost i

Stencil cleanliness and inspection

Electronics Forum | Thu Jun 07 13:40:12 EDT 2001 | kerryn

Dave, We have very short runs (less than one hour). We have stencils all over the place waiting to be cleaned. It is too time consuming to scope each stencil to inspect for cleanliness. Do you know of any automated or scanning devices that can ra

Re: BGA Xray inspection

Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean

Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro

Re: Solder paste inspection

Electronics Forum | Mon Aug 10 13:36:33 EDT 1998 | Mike Moninger

| | I am trying to get an idea of what system seems to work best for solder paste inspection. I am looking for basic table top models with he capabilites of height and width measurements. Can anyone give me suggestions, pricing and why you prefer

BGA inspection microscope

Electronics Forum | Sat Dec 03 16:26:40 EST 2005 | grantp

Hi, I have seen demos of these scopes, and don't think they really show you very much. If you profile your board right, and drill up to solder a thermocouple onto the inner balls of the device so you really know your getting a good profile, I don't

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