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https://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/info-ionic-contamination-measurement-en.pdf

High Precision CleaningIonic Contamination Measurement The ionic contamination measurement (ROSE Test) is an extractive analysis technique, used to determine average ionic contamination on a component assembly . By using a contaminometer or ROSE Tester, the total ionic content is calculated as an equivalent to sodium chloride, enabling a comparable quantitative resolution of the contamination on the board . For a more precise analysis, complex methods such as ion chromatgraphy and IR spectroscopy are available. These methods analyze the ionic species on the board surface and assess its overall cleanliness level. We offer : n Identification of the ionic contamination on your electronic assemblies (maximum size 350 x 250 x 80 mm / 140 x 100 x 32 inch ) n Performed in accordance with IPC-Standard TM-650 2.3.25 n Evaluation of the measurement result in accordance with IPC Standard J-STD-001 n A detailed technical report Ionic Contamination - Measurements Technique

http://www.zestron.com/fileadmin/Filestorage/RESPONSIVE_Website/2-Products/TIs/EN/info-ionic-contamination-measurement-en.pdf

High Precision CleaningIonic Contamination Measurement The ionic contamination measurement (ROSE Test) is an extractive analysis technique, in order to determine average ionic contamination on a component assembly . By using a contaminometer or omegameter, the total ionic content is calculated as an equivalent to sodium chloride, enabling a comparable quantitative resolution of the contamination on the board . For a more precise analysis, complex methods such as ion chromatography are available. This method analyzes the ionic species on the board surface and assesses its overall cleanliness level. We offer ) n Performed in accordance with IPC Standard TM-650 n Evaluation of the measurement result in accordance with IPC Standard J-STD-001 n A detailed technical report The principle - ionic contamination measurements @zestron.com Americas infousa@zestron.com Korea infokorea@zestron.com South Asia infoasia@zestron.com East / South China infochina@zestron.com Japan infojapan@zestron.com Benefits: n Ionic contamination measurement is suitable for post-soldering proof of purity per offical regulations, verifying surface quality following cleaning of prior to subsequent coating or bonding

EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993)

https://store.aciusa.org/EMPF-RR0013-An-In-Depth-Look-at-Ionic-Cleanliness-Testing-August-1993--P117.aspx

EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993) Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home  >  Publications  >  Digital Downloads  >  EMPF White Papers EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993) Item #: 400037 Our Price: $0.00 Quantity:   Description Reviews Also in EMPF White Papers Description ) surface areas get smaller, surface residues will become harder to measure accurately.  On small surface areas, variables such as probe limitations, solvent volume, and even carbon dioxide from the air will influence ionic contamination measurements + Add to Cart Top Sellers EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993) 400027 Price: $0.00 + Add to Cart EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993) 400037 Price: $0.00

EMPF RR0015 - Phase 2 Testing of Petroferm Bioact EC-Ultra (December 1993)

https://store.aciusa.org/EMPF-RR0015-Phase-2-Testing-of-Petroferm-Bioact-EC-Ultra-December-1993--P119.aspx

+ Add to Cart EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993) Price: $0.00 + Add to Cart EMPF TB0021 - Statistical Process Control in Manual Soldering (September 1989) Price: $0.00 : $1,595.00 More Info Top Sellers EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993) 400027 Price: $0.00 + Add to Cart EMPF RR0013 - An In-Depth Look at Ionic Cleanliness Testing (August 1993) 400037 Price: $0.00

Ionox | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/cleaning-chemistries/ionox/

. Ionox FCR has superior solvency for carboxylic acid structures, rosins, resins and ionic contaminants. Ionox FCR has a low vapor pressure, which reduces concerns of flammability and smell . The polarity driver provides Van der Waals forces of attraction for mild acidic soils. The hydrogen bonding driver provides water solubility and the ability to remove ionic contaminates . A major benefit of Ionox FCR is its complete water solubility. This enhances the ease of rinsing and removal of ionic contamination. Ionox FCR is buffered to maintain a stable pH over a wide level of flux loading . I3302 has superior solvency for carboxylic acid structures, rosins, resins and ionic contaminants. Ionox I3302 has a low vapor pressure, which reduces concerns over flammability and smell . The polarity driver provides Van der Waals forces of attraction for mild acidic soils. The hydrogen bonding driver provides water solubility and the ability to remove ionic contaminates

Kyzens Mike Bixenman to Present R.O.S.E Research | Kyzen: Eco-Friendly Cleaning Products, Industrial

https://www.kyzen.com/main-pages/kyzens-mike-bixenman-to-present-r-o-s-e-research/

. method limitations arise from the methods’ inability to dissolve many of today’s flux residues, and to remove and detect ionic contamination trapped under low component clearances . The purpose of this research paper is to test the effectiveness of new ion exchange resins for removing both ionic and non-ionic contaminants from improved extract solvents Dr

Electronics in Harsh Environments Conference

https://www.smta.org/harsh/tech2018.cfm

. Reliability data using IPC Test Methods and the Bono test data will be presented. Session 3 - Advanced Test Methods + Quantification of ionic contamination present on electronic assemblies is of extreme importance, especially when the end product functions within harsh environments . Marietta Lemieux of STI will present research on detection levels of ionic contamination trapped under leadless and BTC components. The data finds that the extraction time is an important consideration when qualifying and validating levels of contamination on production assemblies . Electrochemical failure modes increase when ionic contamination is mobilized on a board assembly under environmental stress. Dr. Mike Bixenman of KYZEN Corporation will present advanced methods for characterizing ionic contamination under leadless component bodies . Session 4 - Electrochemical Reliability + There is mounting evidence that as PCB component density increases, so does the sensitivity of the circuit to ionic contamination . There have been many industry examples where manufacturers have relied on ionic contamination testers, yet still had product that failed in service

https://www.smta.org/harsh/Harsh-Environments-Conference-Program-2020.pdf?v=20020202210

: Electrochemical Reliability of PCB in the Automotive Industry Does the measurement of ionic contamination predict reliability? – Realization of IPC-J-STD001G-Am1 in the automotive Industry *Lothar Henneken, Ph.D . Conductive Anodic Filament (CAF) Failures under High Voltage Temperature Humidity Bias Testing (uo to 1000V) *Martin Wickham, NPL Non-destructive testing to predict early humidity induced electrical failure on PCBs Simon Lauser, Robert Bosch GmbH REFRESHMENT BREAK Origin of Ionic Contamination in Automotive . Detection of Ionic Contamination under Low-Standoff Components *Helmut Schweigart, Ph.D., Zestron Program continued onto next page TIME Location 8:00 - 8:30 Foyer 8:30-9

Microsoft Word - 35D_TDS_b.doc

https://qualitek.com/wp-content/uploads/2017/06/35Defoamer.pdf

● 86 755 28522814 ● FAX 86 755 28522787 TECHNICAL DATA SHEET 35 Defoamer Rev. B, 4/17 Description Qualitek ® 35 Defoamer is a non-ionic surfactant that will reduce foam when used for aqueous cleaning applications . 35 Defoamer is recommended when foaming is excessive. Main Features Non-ionic Surfactant Effectively reduces foam Technical Data Specification Color and Appearance Clear Liquid Flash Point None Specific Gravity (g/cm 3 ) 1.02

Microsoft Word - 35D_TDS_b.doc

http://qualitek.com/wp-content/uploads/2017/06/35Defoamer.pdf

● 86 755 28522814 ● FAX 86 755 28522787 TECHNICAL DATA SHEET 35 Defoamer Rev. B, 4/17 Description Qualitek ® 35 Defoamer is a non-ionic surfactant that will reduce foam when used for aqueous cleaning applications . 35 Defoamer is recommended when foaming is excessive. Main Features Non-ionic Surfactant Effectively reduces foam Technical Data Specification Color and Appearance Clear Liquid Flash Point None Specific Gravity (g/cm 3 ) 1.02

Microsoft Word - 1818-13A BEST.doc

http://www.soldertools.net/product_images/ezreball/Residue_Analysis_for_EZReball.pdf

. Testing Protocol All residues in this evaluation were characterized using Ion Chromatography per IPC-TM-650 2.3.28. Conclusions The ionic residues for these samples are low and pose a minimal risk of electrical leakage. Reported by: Foresite ID

http://www.soldertools.net/content/Heatshield%20gel%20cleanliness%20testing%202015.pdf

2.3.28 using the C3 localized extraction and testing system. U9 BEST –1818-36 10/2/2015 Page 3 of 9 1982 S. Elizabeth St., Kokomo, IN 46902 • (765) 457-8095 • F: (765) 457-9033 • www.foresiteinc.com Ion Chromatography Data Findings / Conclusions Samples from the group of no cleaning show very high levels of ionic contamination . Therefore, they require lower levels of flux on final assemblies. Bromide (Br-) Bromide ionic species are generally attributable to the bromide fire retardant additives that are included in the manufacture of epoxy-glass laminate circuit boards and subsequently extracted on a functioning assembly. It is these residues that the C3 has been designed to assess. The extraction solution has been designed to achieve effective ionic residue removal using a heated delivery system consisting of 3 stages. 1. Solution heating and delivery is an additional 3 minutes. 3. The solution is transferred to a test vial and placed into an auto-sampler which injects the solution into the ion chromatograph for ionic analysis. 4. A 1.5mL sample of each test sample's extract is analyzed using a 1.7mM sodium

Hostapur AE

https://www.clariant.com/en/Solutions/Products/2014/11/24/11/15/Hostapur-AE

& Solutions Business Units Sustainability Innovation Company Media Investors Careers Close Home / Products & Solutions / Products / Hostapur AE Products Hostapur AE Blend of anionic and non-ionic surfactants Hostapur AE Blend of anionic and non-ionic surfactants Edition Date : September 27, 2019 Blend of anionic and non-ionic surfactants Benefits Particularly suitable when used in hard water or alkaline environment

Hostapur AE

https://www.clariant.com/de/Solutions/Products/2014/11/24/11/15/Hostapur-AE

Lösungen / Products / Hostapur AE Products Hostapur AE Blend of anionic and non-ionic surfactants Hostapur AE Blend of anionic and non-ionic surfactants Änderungsdatum : September 27, 2019 Blend of anionic and non-ionic surfactants Benefits Particularly suitable when used in hard water or alkaline environment

Phosphors article

http://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf

. In a phosphor-driven light emitter, this down-conversion process accounts for most of the energy loss in the LED. Most phosphors are two-component systems, consisting of a host crystal matrix containing luminescent ionic centres defects convert pump light from the LED chip to heat, magnifying defect formation and diminishing light output. Another problem associated with a high phosphor temperature is that it drives subtle changes in the chemistry of the active ionic species

Phosphors article

https://www.gpd-global.com/co_website/pdf/pump/Phosphors-LED.pdf

. In a phosphor-driven light emitter, this down-conversion process accounts for most of the energy loss in the LED. Most phosphors are two-component systems, consisting of a host crystal matrix containing luminescent ionic centres defects convert pump light from the LED chip to heat, magnifying defect formation and diminishing light output. Another problem associated with a high phosphor temperature is that it drives subtle changes in the chemistry of the active ionic species

Used Critical and Semiconductor Equipment Seller… | LEL International

https://www.wearelel.com/semi/buy/semiconductor-processing-equipment/sold

. With dry etching, oxygen or another gas is used to eliminate the filmy cover. Ionic Implantation: A powerful electron beam penetrates the wafer, allowing for dopants to be implanted during diffusion. Metal Deposition

Semiconductor Processing Equipment | LEL International

https://www.wearelel.com/semi/buy/semiconductor-processing-equipment

. With dry etching, oxygen or another gas is used to eliminate the filmy cover. Ionic Implantation: A powerful electron beam penetrates the wafer, allowing for dopants to be implanted during diffusion. Metal Deposition

HeatShield Gel™ For PCB Rework/Repair - Solder.net

https://www.solder.net/products/heatshieldgel-tm/

™ tape by a factor of 4X! It has shown to be innocuous to the PCB through thorough ionic cleanliness testing assuring you that when cleaned up properly the reliability of the board will not be impacted by using this product

http://www.smta.org/files/SMTAI.PDF

http://seikausa.com/sites/default/files/product/mcdry/msd-storage-technical-article.pdf

. Although a component with external cracking may pass pre-shipment functional tests, subsequent high temperature and moisture exposure can induce the transport of ionic contaminants through

empfasis

http://seikausa.com/sites/default/files/product/mcdry/empf-asis-may-2001.pdf

. The second common failure mode associated with moisture in packages is corrosion of internal metallic struc- tures (e.g. wire bonds). New plastics that have less mobile and low overall ionic contaminates have minimized observations of these types of fail- ures

Program_WEB for 2017 draft 1.18.17.xlsx

http://smta.org/panpac/Pan-Pacific-2017-Program.pdf

Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes Brook Sandy‐Smith, Indium Corporation  Ionic Test Method Panel Moderator: Chuck Bauer, Ph.D., TechLead Corporation Debbie Carboni, KYZEN Corporation Jeff Kennedy, Celestica Inc . Terry Munson, Foresite Inc. Brook Sandy‐Smith, Indium Corporation Karl Seelig, AIM Comparison of Ionic Contamination Test Methods to Determine Their Ability to Reliably Predict Performance Risks Phil Isaacs, Jennifer Porto, Dave Braun, IBM Corporation

Tutorials | SMTA International

http://smta.org/smtai/tutorials.cfm

applications like medical devices and aerospace/military How regulations affect cleaning options New developments in cleaning agents and processes Identify important tests for both ionic and non-ionic residues How to use successful cleaning and defluxing

IPC APEX EXPO 2019 - Conference Brochure

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Conference-Brochure.pdf

: John Lau, ASM Assembly Materials Ltd. PD06 | J-STD-001 AND IONIC RESIDUE TESTING 9:00 am–12:00 pm Instructor: Douglas Pauls, Rockwell Collins PD07 | CONTRACTING WITH THE CUSTOMER: WHAT THE EMS MANAGER AND EXECUTIVE NEEDS TO KNOW 2:00 pm–5:00 pm

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Pocket-Guide.pdf

. 2 Non-Contact Additive Technologies in Contemporary Electronics Production and Related Fields PD01 9:00 am 12:00 pm Gustaf Martensson, Mycronic AB / KTH 6C J-STD-001 and Ionic Residue Testing PD06 9:00 am 12 : Rick Shanks, Pratt & Whitney; Walter Jager, ECD Compliance 6F Thermal Stress Test Methodology Subcommittee D-32 8:00 am 10:00 am Chair: James Monarchio, TTM Technologies 7A Ion Chromatography/ Ionic Conductivity Task Group 5-32A 8

IPC TM-650 Test Methods Manual | IPC

http://ipc.org/test-methods.aspx

2.3.25.1 Ionic Cleanliness Testing of Bare PWBs - 10/00 TM 2.3.27 Cleanliness Test - Residual Rosin - 1/95 TM 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95 TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method - 11/12 TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes - 6/04 TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography - 12/09 TM 2.3.29 Flammability, Flexible Flat Cable

Committee Home Pages | IPC

http://ipc.org/CommitteePage.aspx

Task Group 5-31g Stencil Cleaning Task Group 5-31j Cleaning Compatibility 5-32 Cleanliness Assessment Subcommittee 5-32a Ion Chromatography/Ionic Conductivity Task Group 5-32b SIR and Electrochemical

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