Electronics Forum: ipc 610 (Page 11 of 42)

Solder Joint

Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.

Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T

We're gettin' the standard!

Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef

See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6

RF surface mount assembly

Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau

RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have

Workmanship Standards

Electronics Forum | Mon Apr 10 16:18:56 EDT 2000 | Mark Belec

I need some input to clear up some confusion I have with regards to what standard I should be using for workmanship on the pcb assemblies we produce. Should I be using the IPC 610b or the ANSI-J-STD-001B? What is the norm for the industry or is the

wavesoldering

Electronics Forum | Wed Nov 20 10:33:14 EST 2002 | dphilbrick

Adam Generally the answer is yes. But there are many considerations. First a couple of questions 1 what flux are you using 2 Do you have top side pre heat in your wave solder machine 3 what is your measured top side temp. 4 what is your dwell time

Inspection training

Electronics Forum | Mon May 24 14:44:21 EDT 2004 | ekcinieh

My snmall company out-sources all of it's SMT assemblies. We do through work and have dome rework experience with SMT. All of our assemblies are built to "IPC610 Class II". We currently have no one trained to inspect to this standard. What is a pract

Solder balls under LLP

Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos

Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c

SMD acceptable criteria

Electronics Forum | Fri Dec 09 13:32:14 EST 2005 | jbrower

Hi Ajay, Does your company currently use any quality standards or is it made up as one goes by the QA department? You might find that using IPC 610A Acceptability of Electronic Assemblies very usefull. This manual is our base line for acceptable or

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Mon Feb 20 04:59:40 EST 2006 | Loco

For visual inspection table 1-2 seems to be in order here. If you can not see the bottom using 1.8 and table 1-2, it clearly would be a defect and rework would be the only option Well, my thoughts anyway, wonder if someone has other thoughts on thi

This is a new one

Electronics Forum | Tue May 16 14:05:44 EDT 2006 | Mike

Hello, Heres my take. If the ends that are touching are connected by trace, and IPC-610 is satisfied, and the connection does not make a Parallel circuit where a series circuit is required, then I would treat it as a process indicator. That is, unle


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