Electronics Forum | Wed Nov 03 15:55:42 EST 2004 | davef
Dennis: The IPC-A-610 requirements are seperate. * You need to meet all acceptance requirements, in order to be in compliance. * If you reject a part for any reason, you are not in compliance.
Electronics Forum | Fri Apr 08 04:48:34 EDT 2005 | vinitverma
7mils/inch is 0.7% and the IPC-A-610 calls for 0.75% (for SMT), so both are approx. the same. So there are no two methods in what you described. The 7mil/inch is also a percentage. Regards Vinit
Electronics Forum | Fri Jul 29 19:37:02 EDT 2005 | Jason Fullerton
If you are 100% inspecting, then all assemblies should be inspected to IPC-A-610 not just the first one. It sure would be nice if assemblies # 2 - 1000 were exactly the same as the first article, but they aren't.
Electronics Forum | Mon Aug 29 13:05:11 EDT 2005 | solderguy
Hi All, In IPC-A-610 there is a definition for what constitutes "Entrapped/encapsulated/attached" on page 5-14 in the note. It says that it means that the ball will not be dislodged in the normal service environment of the product. Jim Jenkins
Electronics Forum | Thu Nov 10 11:39:51 EST 2005 | Adam
HI Is there Industry Consensus Document , which is an equivalent of the IPC-A-610D : Acceptability of Electronic Assemblies for "Mechanical Assemblies" ? THANKS ADAM
Electronics Forum | Wed May 03 15:45:44 EDT 2006 | Tim
Brett, I've found out that it is not a defect with respect to Rev. D. You are correct about the thermal expansion but due to the size of the plastic SOIC's and SOT's they have eliminated it as a defect. Thanks, Tim
Electronics Forum | Mon Jan 08 10:29:15 EST 2007 | jaime39
The water soluble flux residue is staying there because the rinsing temperature it may be too low. The flux needs about 130-140 degrees celcius to become soft. If you are using water soluble flux, as per IPC A 610 standards it needs to be remove comp
Electronics Forum | Mon Mar 12 09:55:55 EDT 2007 | coop
I am aware of the IPC A-610 standards on acceptability of electronics, but this place builds our products to an even higher standard. the problem is on the two leading corners of the IC's as they go into the wave.
Electronics Forum | Thu Apr 12 08:16:19 EDT 2007 | davef
Toe down solution: * Land pattern design * Solder stencil design * Proper component fabrication Normal gull wing lead solder requirement: Solder must extend to the mid-point of the outside of the lead bend.
Electronics Forum | Sun Aug 24 08:57:56 EDT 2008 | davef
For an nate measurement method, look here http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.22c.pdf For bare boards, look to IPC-6012, par. 3.4.4 For assemblies, look to IPC-A-610
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