Electronics Forum | Mon Dec 18 08:52:57 EST 2006 | russ
You need to get yourself a copy of IPC 610. this has all the specs regrding placement and registration. chip aprts are allowed to have 50% side overhang. the fillet requirements are "evidence of wetted fillet" . I would not know if a cap being 51
Electronics Forum | Thu Jan 04 21:48:53 EST 2007 | davef
You mean it's not OK to celebrate Notre Dame loosing its ninth straight bowl game since 1995? * Notre Dame has lost the last 16 games against teams with top 10 rankings. * Fighting Irish haven't beaten a team of real consequence in the last two seaso
Electronics Forum | Thu Mar 01 18:46:05 EST 2007 | fastek
I'm having a difficult time understanding the need anymore for a West Coast show going forward. Other than tradition, let's face it.....there is much more going on in the midwest these days. All and all....I don't see much of a future in Southern C
Electronics Forum | Fri Feb 02 21:31:38 EST 2007 | bill_gates
Hi, I am considering to use pressfit D-Sub and DIN connectors on a backplane. The IPC guideline does just cover pin protrusion for soldered pins, which have to be flush with the board as a minimum acceptable design. Yet, if the backplane may be thic
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Fri Mar 16 14:48:59 EDT 2007 | drt
I noticed a difference in the specifications from the Japan web site to the US site. IPC9850 Speed in Japan is 25,000. US is 27,000. Accuracy in Japan is stated at 50 microns at 3 sigma. US is stated at 40 microns at 3 sigma. 01005 capability is di
Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef
Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio
Electronics Forum | Tue Mar 27 13:49:18 EDT 2007 | pima
Yea. I think that http://www.topline.tv/SMDnomen.pdf is even better. But the problem is that these two files was done in 1998 and from that time 0402 its not a prototype anymore its a standard. I would like to have this kind of document but more curr
Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef
Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.
Electronics Forum | Wed Apr 18 08:44:15 EDT 2007 | pjc
Every failure analysis study I've seen, (and quite a few by now) showes Pb Free failing in about half the time or cycles as Sn/Pb. HALT and HASS testing shows reality- run way from a Pb Free product other than a camcorder, etc...
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