Electronics Forum | Fri Jun 03 16:35:40 EDT 2005 | davef
We've never tried to remove Paraylene from a BGA, but we stayed [in seperate rooms] at the Red Roof Inn. Parylene/Paraxylyene is a great coating and can be selectively removed by several methods. IPC-7711 (Rework of Electronic Assemblies) has a sect
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Tue Jun 28 12:12:17 EDT 2005 | Paul
I'm with DaveF on this one. I think you'll be trying solve this one for a long time. Alloy42 just doesn't like to be soldered. What exactly is the issue? Lack of a toe fillets at on the cropped lead? There is no spec for a toe fillet other than to
Electronics Forum | Wed Jul 20 13:47:42 EDT 2005 | russ
IPC has this. I cannot remember which one, Here is what I do for a quick reference. square pin - add .015" to the pin dimension e.g. .025" square pin gets a .040" hole. OR if the pins are large get the max dimension )e.g. a .025" square pin has
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Wed Dec 14 08:21:25 EST 2005 | tk380514
good points but to answer your questions... Although i am aware of most of those potentail problems we havent had most of them, fingers crossed. Unfortunately we have 2 sub-contractors doing the PCB palnning and design which mean i have to solve ther
Electronics Forum | Thu Jan 12 13:21:11 EST 2006 | barryg
Opinions. I have a large finned heatsink that we place over a D2pak transistor. This heatsink is designed to heatsink the transistor through the junction of the pad area that the transistor is attached to. The paste pattern we chose was small dots ar
Electronics Forum | Wed Feb 22 12:06:23 EST 2006 | Chunks
I agree with Steve and would hate to have Ken audit me. "Mrs. Chunks, sure your profile looks like the manufacturers recommended spec, your oven is calibrated to the best you can do or afford, your profiler is also calibrated to the best of your cap
Electronics Forum | Tue Feb 28 10:18:35 EST 2006 | Steve Gregory
I just went through the same problem. We have an inductor that is made with a bundle of 30-strands of Litz wire that is vaccuum coated with varnish, and have the ends of the wire bundles tinned that we have to solder to SMT pads on the board. The ind
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
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