Electronics Forum | Wed Sep 23 11:50:34 EDT 1998 | Jeff Ferry
| Can anybody point me to a Standard that provides details on the use of Wire Links for the repair of SMT PCBs, e.g. the maximum number of permissible links, the material to be used, the method of joint etc.? At the next meeting of the IPC Repair com
Electronics Forum | Thu Apr 16 14:31:04 EDT 1998 | Lou Madge
Dear Colleague, A seminar titled "Things that you should know before selecting an alternative surface finish" will be offered on Friday , April 24 in Philadelphia (during the Nepcon East week). The seminar will be covering topics related to the SERA
Electronics Forum | Mon Apr 20 13:49:49 EDT 1998 | Gordon Wenker
| Dear Colleague, | A seminar titled "Things that you should know before selecting an alternative surface finish" will be offered on Friday , April 24 in Philadelphia (during the Nepcon East week). | The seminar will be covering topics related to th
Electronics Forum | Thu Apr 16 14:29:07 EDT 1998 | Lou Madge
Dear Colleague, A seminar titled "Things that you should know before selecting an alternative surface finish" will be offered on Friday , April 24 in Philadelphia (during the Nepcon East week). The seminar will be covering topics related to the SERA
Electronics Forum | Thu Apr 09 00:07:54 EDT 1998 | Bonnie
I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have no
Electronics Forum | Thu Apr 09 00:12:02 EDT 1998 | Bonnie
| I am in urgent need of a pcb land patten (footprint)for this device. I have the component data sheet with with package dimensions from Motorola, but they do not include the recommended land pattern. I requested a patten over a week ago, but have
Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach
| Peter, | Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. | Whatever, they do reference one another. | | Question: Whatparameters are used to determine "good" Solder Paste? What refer
Electronics Forum | Thu Apr 02 11:19:41 EST 1998 | Justin Medernach
| I am looking for footprint details on a SM crystal. | Package type - Golledge GSX49-4. | Solder method - refolw Mark, Check with the good folks at IPC for land design. The spec should be IPC-SM-782. Also, see http://www.ITM-SMT.com. It's Phil Za
Electronics Forum | Tue Nov 27 20:32:38 EST 2001 | davef
Stress is meaningful if it affects the long term reliability in a product's end-use environment. I don�t believe that things are that straight forward, although it would be nice if they were. Consider that differences in materials, number of layers
Electronics Forum | Thu Nov 29 17:30:07 EST 2001 | davef
You give no clue of what you want to write about. Let's try this: J-STD-001, 8.3.1 Particulate Matter says words to the effect of solder balls / splats shall be neither: * Loose or able to be dislodged during normal service � NOR * Violate minimu
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
