Electronics Forum: ipc standard for pin protrusion (Page 1 of 1)

Looking for IPC or other standard for electronics / electro-mech

Electronics Forum | Fri May 04 18:24:48 EDT 2001 | ashokdha

I am looking for an IPC Standard (s) or other standard (s) for electronics assemblies. The kind of operations involved are riveting, assembly of backpanels and circuit cards into metal shelf, wire wrap , soldering , contact pins , cabling etc.

Standard for automated placement & assembly, density etc.

Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef

The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize

Component Zero Orientations for CAD Libraries

Electronics Forum | Fri Jan 04 21:58:03 EST 2008 | mika

Hi everybody out there, A little interesting something for all of us of how to handle the cad-component orientation in regards to cad import into your SMT-machines S/W (Fuji Flexa, FujiCam, UIC, Siemens, Pana, Mydata or Whatever). We have struggle f

SMT solder pad design for hand soldering

Electronics Forum | Sat Apr 19 12:00:07 EDT 2003 | modeltech

I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly. My proble

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

Dye Penetration test for area array package failure analysis

Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef

First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis

PIHR Inspection Criteria

Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis

Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just

Pin Through-Paste with Lead-Free

Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef

We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi


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