Electronics Forum: ipc-782 (Page 1 of 3)

Re: Component Package Specs

Electronics Forum | Tue Jan 18 12:53:50 EST 2000 | Russ

IPC 782 has package dimensions Russ

Temp. Specs on SMT parts

Electronics Forum | Mon Nov 29 18:54:30 EST 2004 | russ

IPC 782 has some info in it by package type. This is usually dictated by each component manufacturer. All SMT parts should be able to withstand 220 C for at least 60 sec. Russ

0402

Electronics Forum | Tue Jun 07 14:31:56 EDT 2005 | russ

No max spacing spec. except that it should not be so far away from the other one that it is no longer on the board! IPC 782 shows .5mm spacing for the min.

This is a new one

Electronics Forum | Tue May 16 14:17:34 EDT 2006 | russ

If the terms are connected electrically it does meet IPC bridging between "non common conductors" is the defect you should be fine, FYI, the .010" spacing is a violation of IPC 782 Russ

Re: BGA and Land Patterns

Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank Frank, Refer to the device manufacturers. they are going to have a recomme

Best Land Pattern design for 0402 Resitors?

Electronics Forum | Fri Jan 14 11:16:45 EST 2005 | Dan Gosselin

I have heard of people using a round pad or Home plate design to decrease the incidence of tombstoning on 0402's Anyone have any practical experience on this or is everyone just using the IPC 782 recommended land pattern (28mil x 33mil rectangle pad

This is a new one

Electronics Forum | Tue May 16 14:37:10 EDT 2006 | slthomas

Thanks for the replies, fellas. Pretty much what I'd thought too, but you know, when it just doesn' LOOK right.... "the .010" spacing is a violation of IPC 782" Not my problem. ;) You should see the decal they're using for the Xilinx PQFP 208. No

Re: IPC/MIL STANDARDS

Electronics Forum | Wed Jan 12 13:19:20 EST 2000 | Wolfgang Busko

Hi Abbas, Dave gave you a lot of sources which cover I think almost all topics in this field. Like in a search function if you are interested in specific topics could you please specify what you are interested in so that ones knows what answer could

Re: Wave Soldering SMT IC

Electronics Forum | Tue Oct 17 01:42:34 EDT 2000 | Peter Carry

Dave, That's the funny thing, thru all that the output was pretty consistant with at least one bridge per board. * The ICs are going thru the wave in-line, according to IPC-782 figure 3-9, "Preferred IC Orientation". * Flatness of second wave is cont

Round Solder Lands

Electronics Forum | Fri Mar 02 06:25:04 EST 2001 | PeteC

Thanks for your feedback. All the 0603 chips have the round solder lands but the 0805 chips and larger are rectangular. After speaking with the designer on it he said they chose round lands for the 0603 chips to get higher density of the circuit trac

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