Electronics Forum: ipc-tm-650 2.6.28 (Page 1 of 1)

Excessive Heat / Thermal Excursions From Baking

Electronics Forum | Fri Sep 03 16:43:13 EDT 2021 | djenkins62

Hello Everyone, We are building devices to remove moisture from boards prior to rework where it does not require the use of ovens as stated in IPC-TM-650, Method 2.6.28. Instead of evaporation, we use moisture magnets to pull out the part......even


ipc-tm-650 2.6.28 searches for Companies, Equipment, Machines, Suppliers & Information

Software for SMT

Want to know where to find the best AOI system? - Read testimonials.
2021 IPC Training Schedule

Best Reflow Oven
PCB Depanelizers

Heller - Best value SMT Reflow Ovens in the market.