Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Jan 07 18:07:59 EST 2003 | davef
J-STD-001 prescribes acceptable temperature and humidity ranges for electronic assembly, but does not discuss required instrumentation, nor its accuracy nor coverage. We're unaware of another standard that requires such a thing. The standards of to
Electronics Forum | Fri Jul 11 09:58:18 EDT 2003 | Chris
Good Day Everyone, We are a contract manufacturer. We are constantly receiving MSD components in consignment kits that are not sealed, not in the right bags or have no desiccant. When this occurs, we bake the parts per JEDEC J-STD-033A. We recently
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Thu Mar 04 12:00:56 EST 2004 | tryn
I am looking at two different type fluxes, Kester 951nc and AIM 264-5nc. The two seem to be comparable, but the Kester is listed as an ORL0 and the AIM as a ROL0. My product builds are all military and I have been dictated to use only ROl0 flux. I kn
Electronics Forum | Mon Mar 08 14:39:54 EST 2004 | Gabriele
Have you considered those Tant Caps could be moisture Sensitive Components ? During last year, several Brand Suplliers classified their Tant Caps as Moisture Sensitive Level 2a (4 wks out of dry pack before reflow, see J-STD-033a) some even MSL:3
Electronics Forum | Mon May 24 15:45:58 EDT 2004 | mleber
I am interested in how Military / Class 3 manufacturers are handling Gold SMT components. We are receiving an increasing number of tape and reel components that are gold plated. Per J-STD we need to tin all gold components. Are parts being removed fr
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Thu Sep 02 11:31:19 EDT 2004 | kmorris
Hi: I am wondering what others are doing that use a Static Ionic contaminate test (e.g. Ionograph/Alphametals) in relation to time. Our Ionograph has the option of setting a test time, or setting it to auto-terminate when there is no change in resis
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