Electronics Forum | Mon Feb 07 14:54:30 EST 2005 | davef
Industry assembly procedures say: * ANSI/IPC-A-610, in section 3.4.1, as a guideline, indicates that "There must not be any eating, drinking, or use of tobacco products in the work area." * ANSI/J-STD-001, in section 3.7, "Eating, drinking, and/or u
Electronics Forum | Wed Feb 23 22:38:28 EST 2005 | davef
We: * Cure 1B73 according to spec in a heat box, like a Blue-M * Clean nozzles [one set in use, one set being cleaned] in thinner in a bronson ultrasonic cleaner * Haven't evaluated coatings in years, but would do it according to J-STD-001C, Reqmnts
Electronics Forum | Mon Oct 02 06:41:53 EDT 2006 | saaitk
We have a customer enquiry that requires PCB assemblies to be cleaned to J-STD-001 / -004 class 3. We use both water based and no clean process chemistries. No clean flux residues are not permitted and would therefore have to be cleaned. My question
Electronics Forum | Mon Oct 02 20:28:25 EDT 2006 | davef
Assuming: * Customer board has been designed to provide for cleaning under components. * Cleaning equipment is capable. In meeting J-STD-001, your current cleaning equipment should be able to clean: * Water washable fluxes. * Low residue fluxes, pro
Electronics Forum | Wed Jul 18 11:49:59 EDT 2007 | davef
The auditor may be using "verify" in an ESD Program context. See ANSI/ESD S20.20 [1999], 6.1.3, Compliance Verification Plan. It gives one definition of what the auditor may be seeking. For more on verification programs, look here: http://www.protek
Electronics Forum | Tue Aug 14 19:49:21 EDT 2007 | htran
My apology for not mentioned the J-STD-001DS. I didn't mean to trick you. Anyway thanks for your inputs. You are the man with the smt knowledge, I am sure that I will be asking you for some more answers again. Thank you for the link. I will loo
Electronics Forum | Mon Jul 14 07:49:50 EDT 2008 | edmaya33
Do we really need to follow the IPC J-STD-001 Solder purity? If so, how to effectively balance the chemistry of Sn63/Pb37 other than adding a pure tin on the solder bath? Is this really needed to monitor in monthly basis?How many kgs of pure tin pe
Electronics Forum | Fri Nov 14 07:56:49 EST 2008 | davef
Section 9 of J-STD-001 gives you what you need. Further: * Flattened [coined] lead: http://workmanship.nasa.gov/lib/insp/2%20books/links/sections/files/711.pdf * Flat lug lead: Look for the Package Designator �LT� on page 7 of http://www.allegromicr
Electronics Forum | Sun May 02 11:44:03 EDT 2010 | davef
J-STD-001 is your base requirement, but MIL and SPACE have stringent requirements for soldering gold plated terminals, e.g. this typical one: http://xweb.nrl.navy.mil/glast/CALDesign/CDE/CAL%20DPD%20Wire%20Cable%20Soldering%20and%20Staking%20Spec%20
Electronics Forum | Thu Sep 05 22:36:38 EDT 2013 | davef
Yes, providing your: * Inbound material does not compromise your process. * Soldering processes apply the proper amount of flux and activate it properly * Material handling does not contaminate your boards Recognize that the IPC requirements of less
