236 joe results

Electronics Forum: joe (Page 1 of 24)

Mydata vs Siplace

Electronics Forum | Mon Apr 23 01:40:39 EDT 2001 | joe

Hi, I am looking for pros and cons of using a Mydata pick and place instead of a Siplace (Siemens). I know that a Siplace is very accurate and capable of placing a very wide range of components (0201 and up) without having to alter the machine or bu

Mydata vs Siplace

Electronics Forum | Tue Apr 24 02:07:27 EDT 2001 | joe

It's not so much of a change but a new investment. We have Siplace lines now, and very pleased with the performance. The reason for looking at the Mydata is to remove all the small stuff from the faster lines and reduce changeover times. The idea is

Profile

Electronics Forum | Wed Jan 09 06:43:07 EST 2002 | joe

I find the most reliable method is soldering the thermcouple to the joint or between the pin and pad. One thing to take care of is not to use to much solder, which would increase the thermal mass.

Philips Pick & Place

Electronics Forum | Tue Apr 08 18:08:27 EDT 2003 | joe

Hello all, I've been out of the P&P process loop for a while and remember when Philips was trying to take over the small FP, flexible world. Where have they gone? Are they called Philips anymore? A web URL would be most helpful. Thanks.

Must read: The Manufacturing Coalition

Electronics Forum | Thu Feb 12 16:25:18 EST 2004 | joe

For those of you that do not know it, our little Republic here is based on Capitalism. Corporations have a right to make a profit. Moreover, a corporation has a responsibility to internal and external stakeholders. Employees are internal and sharehol

EMS Provider

Electronics Forum | Mon Oct 25 21:08:39 EDT 2004 | joe

We will be outsourcing all of our PCBAs and would > like to know if other companies perform DVT > testing, ESD, Emissions on all of your boards or > only on main boards? Our shipping deadline is > near and I would like to determine the risk in >

Lead-free and Leaded solder in the same reflow

Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe

Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.