IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Electronics Forum | Thu Mar 21 15:36:19 EST 2002 | slthomas
We're having trouble with a TO-252 DPAK from Fairchild (MC7805CDT) and our existing land pattern. The land pattern calculator on the IPC site doesn't have anything available that matches it (there are no TO-252's available on the pull downs), and I'
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2013-05-20 16:19:35.0
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.
Technical Library | 1999-08-27 09:24:56.0
Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.
Technical Library | 1999-08-27 09:27:10.0
Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.
IPC Vice President David Bergman explains where to find and how to use the Document Revision Table.
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Training Courses | ON DEMAND | | IPC-600 Trainer (CIT)
The Certified IPC-600 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of bare printed circuit boards and prepare them to deliver Certified IPC-600 (CIS) training.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development
Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).
: Improves contrast between reworked device and land pattern during alignment. Product Comprises: VNZ-19 Vacuum Pick-Up Nozzle 19mm O/D VNZ-08 Vacuum Pick-Up Nozzle 8mm O/D VNZ-05 Vacuum Pick-Up Nozzle 5mm O/D VNZ-03 Vacuum Pick-Up Nozzle 3mm O/D (2.39mm/.094" internal & 17mm/.128" external
. Recommendations will be furnished regarding unique SMT land pattern reinforcement criteria, cover layer and fiducial requirements for automated assembly processing will be defined including detailed
PCB Libraries' "Library Expert" suite uses CAD LEAP(tm) Technology to greatly simplify footprint and 3D STEP model creation; it is used by tens of thousands of PCB designers and engineers all over the world.
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