Electronics Forum | Wed Sep 06 09:06:05 EDT 2000 | Wolfgang Busko
Randy: Seems you have a long way to go to DFM. To your strategy: - proof that in the case of wrong landpattern design the IPC would have been the better choice - count money ( what�s the cost of redesigns due to bad landpatterns ) - establish at leas
Electronics Forum | Tue Mar 21 20:36:11 EST 2000 | Dave F
Armin: Boca makes some good points about release. So, let me spin this up from a different angle ... SM-782 suggests "full radius corners" as an alternative to the more familiar square corner pads on PLCC, TSOP and QFP. We see both also. We thin
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Tue Jul 27 16:30:35 EDT 1999 | Earl Moon
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Thu Jul 22 17:48:06 EDT 1999 | Jim Blankenhorn
| Looking for a cross-referencing and part identification guide for surface-mount components. There is very little infomation provided on some of the components themselves, and we often don't have parts lists or schematics for items we repair, so ide
Electronics Forum | Tue Jun 01 10:26:03 EDT 1999 | Kelly Morris
| Hi, | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | Can somebody help me get started or give some usefull tips on where to find a
Electronics Forum | Tue Jun 01 11:45:54 EDT 1999 | Dave F
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony
| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su
Electronics Forum | Wed Sep 25 05:08:33 EDT 2002 | msimkin
Gregg, We had a similar problem with our 0603 leds. They were being placed bang on, however, during the reflow, they twisted, fell sideways etc. We played with our profile, played with the paste volume & land pattern design, and only had a small impr
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