Electronics Forum | Thu Mar 03 09:29:12 EST 2005 | jdengler
This sounds like you are using a straight ramp profile. For this type of an assembly you may need to use a soak type profile. Most solder paste providers show you both types of profiles that work best with that paste. I would try using that profil
Electronics Forum | Thu Mar 03 10:59:37 EST 2005 | Rob
Also try boosting the bottom zones up to get extra heat in. Now try this at lead free temperatures & watch them go pop as the air inside expands & vents at the base. O to be in America & be free of our wonderful european decision makers.
Electronics Forum | Wed Jan 14 16:52:40 EST 2009 | vleasher
We currently use Epibond 7275 and it cures way too quickly to allow the component to settle down on the board. Have you used the Loctite 3609 in the application i'm speaking of with success?
Electronics Forum | Wed Jan 14 21:42:35 EST 2009 | davef
We view both Epibond 7275 and Loctite 3609 to be very similar. They're competing chip bonders.
Electronics Forum | Wed Jan 14 17:31:24 EST 2009 | swag
Doesn't sound like we use it exactly like your application. Similar to what davef says we use it for smaller to medium size or dense parts (sigle dot under the center of the part) that have potential to fall off on 2nd side processing. I can say it
Electronics Forum | Thu Jan 15 12:32:08 EST 2009 | vleasher
After doing some more research it looks like Loctite made a material called Cornerbond 3515 that seems as if it has the characteristics we are looking for such as curing after the solder is liquidous. But it appears that it isn't manufactured anymore
Electronics Forum | Sat Sep 21 11:53:01 EDT 2002 | reg
Hi. Can anyone point me in the direction of a company (preferably in the UK. Scotland would be even better) I could buy mats from. I'm looking for 700mm square mats for transporting a mech assy between stages down a roller converyor. I've used ones b
Electronics Forum | Mon Sep 23 20:00:21 EDT 2002 | kenbliss
Hi Reg We are not local to you, we are in California, but we can easily ship to you there. However we sell mat material in many types and sizes, cut to size if needed. We also offer trays for the mats for doing the type of work you describe. I do
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t
Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher
I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe
