Electronics Forum: laser cut stencils (Page 16 of 55)

MicroBGA printing problem

Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup

My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks We use 6 mil lasercu

Mylar sheets

Electronics Forum | Wed Oct 08 12:27:08 EDT 2003 | davef

K&J Marketing sells a KEPOCH stencil made of polyimide that is cut with a laser. * We have never used them. [We have no relationship nor receive benefit K&J Marketing.] * SMTnet Archives contain threads on them.

Stencil Thicknes vs. actual solder height measurements

Electronics Forum | Tue Dec 11 19:48:37 EST 2007 | arun2382

Hi, If I were working with a 75 um thick stencil, Is there a spec. as to what the maximum value allowed on actual solder height measurements? Stencil type: Laser cut and electropolished Solder paste type: Type 4 Sn-Sb Would the measured values va

Re: Solder Stencil

Electronics Forum | Fri Aug 28 11:14:46 EDT 1998 | Justin Medernach

General Question to anyone. If you were to go out and build the ideal stencil for pasting boards, what would be the best way to build a stencil? I have some boards that have 19.7 mil pitch parts and the pad width is 10 mil. The length of the pa

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy

I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but

Re: Semi-Automatic Stencil Printing of Fine Pitch

Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy

I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu

Re: problem in micro-BGA assembly

Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff

Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes

Solder paste height checking

Electronics Forum | Tue Feb 22 01:38:42 EST 2005 | JSS

We r using QFPs of 0.5mm pitch and r not getting any soldering prob at the end.But some new customer insists upon the thickness check of the solder paste after printing. At present we don't hv thickness checking system.We r controlling the amount of

Re: MicroBGA printing problem

Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi


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