Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp
Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be
Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby
You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest
Electronics Forum | Mon Oct 09 10:00:15 EDT 2006 | C.K. the Flip
I had a customer like this too. Originally, the customer print called for manual soldering of the RF shield (which took us about 20 min. per shield to hand solder), but I changed it to Solder Reflow (I cut apertures on the stencil), with brass weigh
Electronics Forum | Tue Oct 24 17:01:15 EDT 2006 | grizzy
Well super, super, sorry I had cap locks on - no yelling intended. Let's keep this a technical forum. Many manufacturers charge to register their equipment prior to selling parts or providing service. Agree or dis-agree with this practice it is a re
Electronics Forum | Mon Jul 30 16:34:45 EDT 2007 | John S.
We're seeing shorting from the lead of an electrolytic cap to the can. It appears to be solder wicking up the lead, through the boot, and then shorting to the can. Has anyone else experienced this? It is a very cheap cap from China of course, but
Electronics Forum | Sat Nov 10 22:45:06 EST 2007 | realchunks
1. What is the body size? Who cares. 2. What is the pitch? Doesn't amtter. 3. What is the terminal size? Doesn't matter 4. What is the land pattern size? Really doesn't matter. 5. The Thermal square pad in the middle, with how many vias? If you
Electronics Forum | Fri Dec 12 12:01:44 EST 2008 | realchunks
As the technology has changed towards surface mount, so has the applying adhesive. In the past clinching parts would have knocked off SMD parts, but no that has all changed. So applying the adhesive via screen print is common and any thru-hole part
Electronics Forum | Fri May 31 12:50:42 EDT 2013 | spoiltforchoice
Is this a "thermal balance" issue? In the 2nd image you have a group of pads blobbed together as one giant pad. IMHO this is a bad idea, QFN's rely heavily on the magic of your paste and good PCB design to get good alignment. When your solder paste i
Electronics Forum | Fri Feb 16 09:30:38 EST 2007 | DEK Answer Guy
Hello PR, PumpPrint� technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of
Electronics Forum | Sat Aug 14 07:01:44 EDT 1999 | Earl Moon
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I know we all seek easy/better solut
