Electronics Forum | Mon Jun 17 15:25:10 EDT 2002 | lysik
I would look at Universal for sure. They have a ton of late model Chip placer's and GSM's that they will discount heavy. There are so many used GSM's and HSP's on the market you could probably get what you need for a fraction of the cost. You could p
Electronics Forum | Thu Sep 12 18:50:17 EDT 2002 | scottefiske
Sorry so late in getting into this tehcnical issue. I have seen this condition before...90% of the time in conditions of adhesion on a water soluble material... is the paste...exposure time, lot issue, etc..basically the paste's carriers and binders
Electronics Forum | Mon Oct 07 09:05:41 EDT 2002 | russ
thnaks everyone for the the input. I have been noticing that a lot of comments are referring to 230 deg. C and such. has something changed in the industry lately? It has been to my knowledge previously to peak the reflow at 215 or so. I have many B
Electronics Forum | Wed Oct 09 17:50:09 EDT 2002 | alj
Wrong..! It is a money loser for Teradyne and it will be cut in the future. Wow, auto thermal profiling.. Gee, that is a little late. When will the summit platform be redesigned. It's the same thing they sold 10 years ago with a few modificati
Electronics Forum | Mon Nov 04 12:50:23 EST 2002 | babe
Sorry for being late on the reply. Whatever you do, flux from the container or the manufacturers flux pens. Stick witht the same chemistry. Mixing chemistries, IE: different fluxes will create more problems in rework than you will see if you use the
Electronics Forum | Wed Jan 01 09:20:59 EST 2003 | nifhail
Our new Site in India has been running a lot of NPI lately. Most of the operations, is done manually i.e. Manual Insert. I was asked by the Development Group to invest on AI machine. I'm not sure of whether I should proceed with the investment or no
Electronics Forum | Thu Jan 09 18:19:51 EST 2003 | babe
The Ersa system is fine however there are thermocoupling problems and the service from Ersa has been very poor of late. The Metcal won't handle larger boards and the heating is inconsistent.Especially with BGA components. We see this via inspection
Electronics Forum | Mon Apr 14 14:30:02 EDT 2003 | jonfox
This may be a little too late, but ever heard of a missing "silver". Had one one time (missing ground plane)and wow look at those TANT caps explode...might need some safety glasses! If they are all open look towards the design a little closer just
Electronics Forum | Fri Apr 18 19:27:29 EDT 2003 | yngwie
Under web search you type solder paste softener. It is meant to replace manual stiring process of solder paste prior use. I heard that the spinner/softener is no use as it will seperate the flux and metal content during the spinning process. But, I h
Electronics Forum | Wed Jul 23 08:21:55 EDT 2003 | James
Here we go again. I tried changing paste and that did nothing. Literally solder balled up and flew to the next pad. What would be a short term fix to use up all baards with white tin. Is there a fix if the board house did not manufacturer the boards
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