Electronics Forum | Fri May 23 18:55:20 EDT 2008 | gregoryyork
This is one of the biggest mistakes with the Lead Free process. We have all listened to the 'industry experts' and followed their advice and unfortunately got it wrong. Keep the dwell times (dependant on alloy selection) the same as Leaded so you are
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Sun Jun 10 12:47:36 EDT 2001 | procon
Hi Jacob, NC vs WS, what a story! No-clean paste means no-clean for your products but what a mess it makes in your reflow systems. If you are a contract maunufacturer of high volume production, then No-Clean is they way to go. This helps keep your co
Electronics Forum | Wed Sep 01 20:10:54 EDT 2004 | KEN
The alloy I have chosen uses a wetting angle of 50-70 degrees. Different alloys have different properties. I coupled experimental data with what others have published. Nothing new here. As for reliability...I think you'll be surprised what lead fr
Electronics Forum | Tue Jun 20 19:15:19 EDT 2006 | grantp
Hi, What are your thoughts about the article saying that the lead will leach out of the solder joint to the last place to cool, creating a weak point? I have two worries about the report. First, is that we have always used tin lead solder, and le
Electronics Forum | Tue Jan 31 14:35:55 EST 2012 | hegemon
1. (NCMR) Non Conforming material report to your customer if you have signed up for a lead free job. Send everything back and tell him to replace the entire lot with correct material. or 2. Request a Change order from your customer, changing the
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Thu Jul 20 15:35:32 EDT 2000 | Bob Willis
Well it seems that every one has gone to lunch on the Bob Willis Forum so here are the winners of the Free �Lead Free Soldering Cook Book� Interactive CD ROMs for the best of most questions during the first few hours of the session. All you need to d
Electronics Forum | Fri Feb 24 10:21:59 EST 2006 | Board House
TM, When picking a material for your lead free assembly you need to think about a couple of things, The standard Material in the US that is being used is running 140 - 170 tg. material. But for lead free assembly you need to focus on is Decomp tem
