Electronics Forum: lead free solder paste (Page 31 of 326)

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef

There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass

Putting a center board support on lead free wave

Electronics Forum | Thu Apr 15 10:58:16 EDT 2004 | mwg9184

I am trying to put a center support on a wave solder machine for lead free soldering. My problem is that every metal I use is interacting with the lead-free metals and thus eating away the center support. I have tried titanium, stainless steel. I am

Basic requirements for lead free wave soldering ?

Electronics Forum | Wed Feb 22 21:53:25 EST 2006 | paligora

Thank you Masri, that article was a real eye opener, quite usefull, basic and easy to understand.

The necessity of N2 enviroment on lead free wave

Electronics Forum | Thu Jun 22 10:33:03 EDT 2017 | charliedci

We are changing /adding a lead free wave. This will either be a conversion of a leaded wave or a new purchase. Nitrogen seems to be a necessity in selective soldering lead free, should I presume the same for a wave process? I am interested in first h

Putting a center board support on lead free wave

Electronics Forum | Thu Apr 15 20:55:36 EDT 2004 | Ken

Try: Tungsten, tungsten carbide, ceramics like boron-nitride or how about pyrex glass? Glass blowers could make "hooks" that connect to a cross bar. I would NOT use aluminum (even if anodized). Try stainless steel 316. 303, 304 do not have enough

Loctite as BGA underfill for lead free process?

Electronics Forum | Thu Dec 01 00:34:15 EST 2005 | pyramus

Guy's another question, how about any recommendation what type of adhesive to use as underfill for BGA during lead free process? Currently, we are only using Loctite 3609 & 3515 as adhesive we use 3515 as BGA underfill during normal leaded process s

Lead free Solder Paste troubles !!!!

Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN

The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste

Dry solder

Electronics Forum | Wed Feb 15 01:49:34 EST 2017 | soldertraining

Hi I completely agree with you. Also, the Dry Solder paste can be used in wireless repair operations such as the repair of smart phones, tablets, laptops and other handheld devices. The lead-free solder paste can be squeegeed through the apertures of

Lead free rework of BGA

Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39

When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.

Solder paste type

Electronics Forum | Wed Sep 04 07:15:02 EDT 2013 | anilw2006

We have using SAC305 type solder paste for lead free process. One sample paste received of SN100C.After reflow SN100C type paste joint looks brighter and good compare to SAC305. Please help me which paste is good for smt process?


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