Electronics Forum | Thu Apr 05 11:48:25 EDT 2012 | pbarton
Are you running individual point soldering on each component lead, of are you drawing lines with the solder fountain to increase the speed of the process? Could be that if you are drawing lines, coupled with the very low flux levels you say you are
Electronics Forum | Thu Nov 13 12:24:03 EST 2003 | babe
Hello folks, I have a customer who has what appears to be very oxidized leads on a component. Their component mnf. has no new product to offer and they have 20K of these they have to solder to get product out the door. They are using a no-clean chemi
Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Thu Aug 28 11:15:05 EDT 2008 | omid_juve
I've been there. Soldering no lead parts in a > leaded world can be difficult. Sounds like you > are not wetting to your parts becasue you ar enot > getting hot enough. Here's the trick - you can > turn up your profile to look like a no-lead
Electronics Forum | Tue Sep 15 06:05:58 EDT 1998 | Thomas Blesinger
Does a norm exist, that gives information on soldering of I-leads onto SMT-pads. Especially I am interested in statements about the quality of the solder joints
Electronics Forum | Fri Sep 21 11:02:37 EDT 2001 | davef
You can measure temperatures any place that you would like, but the issue is the temperature of the solder. We've seen solder temperatures that vary from lead to lead on the same component. Why don't you want to measure the temperature of your so
Electronics Forum | Thu Apr 12 08:16:19 EDT 2007 | davef
Toe down solution: * Land pattern design * Solder stencil design * Proper component fabrication Normal gull wing lead solder requirement: Solder must extend to the mid-point of the outside of the lead bend.
Electronics Forum | Mon Sep 10 15:49:28 EDT 2007 | mun4o
Hi, the solder on the pad is not molt.Temperature of the leads is about 220*C( I change this T from 214 to 232) but result is same - solder is granular and not diffuse.I think the T on leads is not enough high,bu I can't increase because the max T on
Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg
I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal
Electronics Forum | Wed Oct 01 10:59:13 EDT 2008 | realchunks
Wouldn't it be cheaper to by quality parts? Most repair operators can solder a QFP 208 with a regular soldering iron, eyes closed and hands behind their back. If you are just touching up the leads because of co-planer leads, a regular iron is all
.gif)
winsouce.jpg)