Electronics Forum | Thu Feb 17 21:45:26 EST 2000 | Dave F
Steve: Wadja mean "I fixed it, now tell me what I did to fix it." Steve, you�re one scary guy. ;-) "Steve�s Longer Pad Theory" - Stubby pads will not make solder flow-up the leads of a QFP100, leaving sparse solder on the pads. Given a choice, s
Electronics Forum | Thu Jul 01 16:43:52 EDT 1999 | Dave F
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Mon Mar 01 11:03:51 EST 1999 | Dennis Xiong
Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o
Electronics Forum | Mon Mar 01 11:03:22 EST 1999 | Dennis Xiong
Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o
Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ
What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig
Electronics Forum | Mon Nov 27 16:52:18 EST 2006 | greg york
Hi Bill Mostly in the UK, but originally saw the problem when I helped on one install in Malta on a chinese mc set at 5 degrees and had nightmare bridging. changed the angle to 6.5 ish and results were instantly better actually better than what they
Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef
There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea
Electronics Forum | Tue Sep 04 15:08:51 EDT 2007 | floydf
We have a job that has through hole components on the top, and one 44 pin j leaded PLCC on the bottom. Presently we put the through hole parts in, run it throught the wave, dispense paste on the PLCC pads, and then apply hot air. Someone suggested we
