Electronics Forum | Thu Feb 19 18:07:57 EST 2004 | davef
We're inclined to buy Russ's stuff about peel from the wave. Look here, but shield your eyes first: [ http://www.thepdfshop.co.uk/ppm/defects/Wave/asp/50.asp ] [A respectful bow to BW for the pix] Could you tell us more about: * Board direction thro
Electronics Forum | Thu Mar 25 08:25:20 EST 2004 | Just another guy with Trouble
I need a source to get several thousand SMT ICs re-tined, does anyone know of anyone that can do this for us. the parts are in tape and reel and will need to be repackaged also. We are in a bind the part itself is an end of life component and these w
Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ
We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.
Electronics Forum | Thu Mar 31 17:27:36 EST 2005 | russ
Are we possibly talking palladium instead of platinum? I haven't yet heard of platinum terminations (seems expensive) If it is palladium over nickel, I can tell you that you need to reach 225-230 Deg. C in reflow and the TAL should be about 90 sec.
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
Electronics Forum | Tue Jan 17 11:19:34 EST 2006 | Kris
Amol, RoHS does not apply to BGA on their own. Depends where they go in ? DVD player vs server board There is "solder exemption" for certain product applications. SnPb ball BGA can used with tin-lead solder on server/infrastructure/switch telecom
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
Electronics Forum | Wed Aug 16 13:29:51 EDT 2006 | SWAG
Is 811 lead paste? If so, it seems to me that your oven settings are getting into soak awful fast in zone 2 and your peak is way high. Unless you are doing a thick board or something like that, those oven settings seem aggressive and might result i
Electronics Forum | Wed Nov 01 08:55:05 EST 2006 | russ
See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I have seen something similar to this possibly in a wave process. We had a very thin board and a very large QFP on top. During wave operation the solder
