Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Mon May 09 09:02:17 EDT 2005 | davef
Your 316L stainless steel pot will not contain lead-free solder, over the long term. We'd bet that our solder machine equipment manufacturer will "swap" you a lead-free solder compatable pot for your current pot.
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Fri Apr 05 18:22:18 EDT 2013 | Adam
We have two ZipaTec 460s Selective Solder Machines, one for Lead and one for Lead-Free. This morning we noticed the solder pot was covered in solder balls, and after asking the operator what they had run, the answer was "Nothing." The operator had al
Electronics Forum | Tue Oct 04 11:42:07 EDT 2005 | Bob Leible
I was wondering if anyone has studied the effects of tin lead solder in the wave. If we leave the same solder in the solder pot, how many COMPLETE cool downs and start ups can the solder go through before it begins to break down? Please let me know
Electronics Forum | Tue Oct 04 12:49:59 EDT 2005 | patrickbruneel
The amount of times the tin/lead solder can be melted and solidified is unlimited and the heat cycles do not affect the solder characteristics. The only reason for changing the solder pot is when impurities are at or over the maximum levels.
Electronics Forum | Thu Mar 02 18:30:38 EST 2006 | jhune
is there a posibilities that a lead solder sticked on the pot can be absorbed by a potato when you placed it on the solder pot. to be able to use the pot for leadfree solder.
Electronics Forum | Fri Jul 14 10:34:04 EDT 2006 | Napoleon
Give me some of your lead tots!
Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas
IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
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