Electronics Forum | Tue Apr 04 16:39:41 EDT 2000 | Kevin Facinelli
Does anyone have any good information on alternative solder paste materials like the Emerson and Cuming CE 3103. I would be interested in any information anyone may have on these new materials...... Thanks, Kevin
Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly
Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY
Electronics Forum | Wed May 11 13:50:30 EDT 2005 | russ
I would contact your paste supplier, bare nickel can be impossible to wet to. How oxidized is it?
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Tue Sep 20 17:38:59 EDT 2005 | kmorris
HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eutectic solder, your approach is a good one. All solder paste does in this assembly application is supply the flux. Additional solder volume is not ne
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Fri May 14 00:34:22 EDT 1999 | Mike D.
| I need some pics or documentation on how a finish soldered joint looks like for SMT component. I have various people who supposedly says has knowledge with High Temp says my joint could look better. The joint looks shiny and great except for a grai
Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
