Electronics Forum | Wed Mar 08 09:47:16 EST 2006 | slthomas
Just guessing here because I haven't researched it and we're not lead free yet, but wouldn't you want a flux chemistry that's optimized for higher iron temps for lead free use?
Electronics Forum | Thu Jul 02 17:26:45 EDT 2020 | mvargas
If I have a leaded board (PCB) and the only component that I have to repair it is a lead-free BGA, what type of solder do I use, leaded or lead-free?
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Wed Apr 26 07:37:52 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Tue Sep 04 03:10:35 EDT 2007 | chrispy1963
We've got 2 lead free lines running at present and one leaded. Our lead free pallets and stencils were both leaded before changing over. Just take care to remove any built up flux from the pallets as well as hidden leaded solder deposits prior to r
Electronics Forum | Thu Oct 05 11:37:15 EDT 2006 | russ
with this design you will have voids, you cannot trap the gas inside of via it has to go somewhere. These vias should be relieved from pad to prevent the scavenging of the paste during reflow. You may try a thicker stencil if you can to allow for t
Electronics Forum | Thu Nov 03 10:49:11 EST 2005 | russ
This is what I would propose, Place and reflow the board without the BGA with your lead process, remove the solder from the BGA pads if you cannot mask off the apertures in your stencil. Then place the BGA and reflow to SAC requirements with a rewo
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Thu Feb 01 05:06:46 EST 2018 | ameenullakhan
Hi Rob, Thanks for your reply. Our customer don't need any pin hole in his board. Attached is the image for your reference. The issue is minimized for us with hot profile ( 80 - 100 sec in between 170 to 180 deg C ) For leaded paste. Lead free pa
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